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US 12,610,461 B2Granted
Laminate for circuit board
AssigneeTokuyama Corporation
InventorsEiki Tsushima, Ryuji Ishimoto, Masakatsu Maeda
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AssigneeTokuyama Corporation
InventorsEiki Tsushima, Ryuji Ishimoto, Masakatsu Maeda
Estimating the term…
The laminate for a circuit board of the present invention is a laminate including a metal nitride sintered board and a copper sheet, and the laminate has a size with a minimum length from a center of a plane to a peripheral edge of 50 mm or more, and has a void ratio X of 0.50% or less, which is a ratio of a total length LB of voids having a diameter of 1 μm or more confirmed in the vicinity of a bonding interface of the metal nitride sintered board and the copper sheet with respect to a measured length LI of the bonding interface, measured on a cut cross section obtained by cutting the laminate in a lamination direction. According to the present invention, a laminate that is excellent in heat radiation capability, has a feature that an etching solution used in patterning is difficult to remain at the bonding interface, and is excellent in reliability as a product can be provided.
A laminate for a circuit board, comprising a metal nitride sintered board and a copper sheet, the laminate having a size with a minimum length from a center of a plane to a peripheral edge of 50 mm or more, and having a void ratio X of 0.50% or less, which is a ratio of a total length LB of voids having a diameter of 1 μm or more confirmed in the vicinity of a bonding interface of the metal nitride sintered board and the copper sheet with respect to a measured length LI of the bonding interface, measured on a cut cross section obtained by cutting the laminate in a lamination direction.
Dependencies are inferred from the claim text.