Multi-layer ceramic plate device

A ceramic heater assembly comprising:

• a ceramic top plate layer comprising a beryllium oxide material;
• a ceramic bottom plate layer comprising a beryllium oxide material;
• a heater layer disposed between the ceramic top plate layer and the ceramic bottom plate layer;
• and
• an annular joining layer disposed radially outward from the heater layer, wherein the annular joining layer further joins and hermetically seals the ceramic top plate layer to the ceramic bottom plate layer.

An electrostatic chuck comprising:

• a ceramic top plate layer comprising a beryllium oxide material;
• a ceramic bottom plate layer comprising a beryllium oxide material;
• a ceramic middle plate layer disposed between the ceramic top plate layer and the ceramic bottom plate layer;
• an electrode layer disposed between the ceramic top plate layer and the ceramic middle plate layer;
• a heater layer disposed between the ceramic middle plate layer and the ceramic bottom plate layer;
• a shaft comprising a beryllium oxide material, the shaft joined to a lower surface of the ceramic bottom plate layer;
• and
• a joining layer disposed between the shaft and the ceramic bottom plate layer.

A ceramic heater assembly comprising:

• a ceramic top plate layer comprising a beryllium oxide material;
• a ceramic bottom plate layer comprising a beryllium oxide material;
• a heater layer disposed between the ceramic top plate layer and the ceramic bottom plate layer;
• a shaft comprising a beryllium oxide material, the shaft joined to a lower surface of the ceramic bottom plate layer;
• and
• a joining layer disposed between the shaft and the ceramic bottom plate layer, wherein the joining layer joins and hermetically seals the shaft to the ceramic bottom plate layer.