C04B 2237/124
Based on copper
Official title: based on copper
C04B2237/124 (Based on copper) appears on 365 US grants and 279 published applications in this corpus.
Search patents in C04B- Granted patents
- 365
- Published applications
- 279
- Assignees
- 195
- Inventors
- 804
- Latest grant
- 28 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 7 | 0 |
| 1977 | 1 | 0 |
| 1978 | 2 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 5 | 0 |
| 1982 | 1 | 0 |
| 1983 | 4 | 0 |
| 1984 | 3 | 0 |
| 1985 | 10 | 0 |
| 1986 | 9 | 0 |
| 1987 | 12 | 0 |
| 1988 | 11 | 0 |
| 1989 | 12 | 0 |
| 1990 | 7 | 0 |
| 1991 | 11 | 0 |
| 1992 | 12 | 0 |
| 1993 | 8 | 0 |
| 1994 | 5 | 0 |
| 1995 | 4 | 0 |
| 1996 | 9 | 0 |
| 1997 | 2 | 0 |
| 1998 | 6 | 0 |
| 1999 | 8 | 0 |
| 2000 | 9 | 0 |
| 2001 | 5 | 4 |
| 2002 | 11 | 11 |
| 2003 | 8 | 3 |
| 2004 | 5 | 13 |
| 2005 | 5 | 6 |
| 2006 | 3 | 3 |
| 2007 | 3 | 6 |
| 2008 | 1 | 5 |
| 2009 | 3 | 9 |
| 2010 | 4 | 17 |
| 2011 | 3 | 7 |
| 2012 | 7 | 14 |
| 2013 | 11 | 7 |
| 2014 | 10 | 15 |
| 2015 | 10 | 13 |
| 2016 | 5 | 25 |
| 2017 | 13 | 9 |
| 2018 | 15 | 11 |
| 2019 | 12 | 16 |
| 2020 | 10 | 12 |
| 2021 | 11 | 11 |
| 2022 | 10 | 14 |
| 2023 | 6 | 13 |
| 2024 | 16 | 16 |
| 2025 | 12 | 14 |
| 2026 | 8 | 5 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Metal-ceramic substrate, method for the production thereof, and module28 Jul 2026US 12,692,202 B2Heraeus Electronics GmbH & Co. KG
- Copper/ceramic assembly and insulating circuit substrate12 May 2026US 12,628,646 B2Mitsubishi Materials Corporation
- Copper/ceramic bonded body and insulating circuit substrate5 May 2026US 12,622,268 B2Mitsubishi Materials Corporation
- Copper/ceramic bonded body and insulating circuit substrate5 May 2026US 12,622,269 B2Mitsubishi Materials Corporation
- Insulating substrate and manufacturing method thereof21 Apr 2026US 12,610,816 B2Dowa Metaltech Co., Ltd.
- Heat Dissipation Substrate for a Power Semiconductor Module, Manufacturing Method thereof, and Convertor including the same13 Aug 2026US 2026/0239967 A1Lx Semicon Co., Ltd.
- Heat Dissipation Substrate for Power Semiconductor, Power Semiconductor Module including the same, Power Convertor including the same, and Manufacturing method thereof13 Aug 2026US 2026/0239968 A1Lx Semicon Co., Ltd.
- Method for producing a pressure sensor6 Aug 2026US 2026/0227258 A1Endress + Hauser GmbH + Co. KG
- Silicon nitride sintered body, silicon nitride substrate, silicon nitride circuit board, and semiconductor device16 Jul 2026US 2026/0200804 A1Niterra Materials Co., Ltd.
- Ceramic substrate, ceramic circuit board, semiconductor device, method for producing slurry, and method for applying release agent1 Jan 2026US 2026/0001819 A1Niterra Materials Co., Ltd.
Most cited
By later US patents
- Functionally stepped, resistive ceramic163US 5,880,439 APhilip Morris Incorporated · 1999
- Multilayer coated abrasive element for bonding to a backing162US 5,049,164 ANorton Company · 1991
- Composite materials156US 4,055,451 A1977
- Abrasive bodies111US 4,522,633 A1985
- Laser brazing for ceramic-to-metal joining104US 5,407,119 AAmerican Research Corporation of Virginia · 1995