C04B 2237/121
Based on aluminium
Official title: based on aluminium
C04B2237/121 (Based on aluminium) appears on 276 US grants and 233 published applications in this corpus.
Search patents in C04B- Granted patents
- 276
- Published applications
- 233
- Assignees
- 147
- Inventors
- 522
- Latest grant
- 24 Feb 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 2 | 0 |
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 4 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 2 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 4 | 0 |
| 1988 | 4 | 0 |
| 1989 | 10 | 0 |
| 1990 | 3 | 0 |
| 1991 | 3 | 0 |
| 1992 | 4 | 0 |
| 1993 | 7 | 0 |
| 1994 | 4 | 0 |
| 1995 | 5 | 0 |
| 1996 | 6 | 0 |
| 1997 | 3 | 0 |
| 1998 | 2 | 0 |
| 1999 | 9 | 0 |
| 2000 | 6 | 0 |
| 2001 | 8 | 5 |
| 2002 | 11 | 11 |
| 2003 | 6 | 7 |
| 2004 | 5 | 11 |
| 2005 | 7 | 8 |
| 2006 | 3 | 4 |
| 2007 | 4 | 5 |
| 2008 | 4 | 4 |
| 2009 | 3 | 3 |
| 2010 | 7 | 15 |
| 2011 | 0 | 5 |
| 2012 | 6 | 8 |
| 2013 | 8 | 11 |
| 2014 | 5 | 16 |
| 2015 | 12 | 12 |
| 2016 | 6 | 19 |
| 2017 | 16 | 18 |
| 2018 | 15 | 17 |
| 2019 | 17 | 8 |
| 2020 | 12 | 16 |
| 2021 | 10 | 8 |
| 2022 | 5 | 10 |
| 2023 | 8 | 5 |
| 2024 | 5 | 0 |
| 2025 | 5 | 3 |
| 2026 | 2 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Multi-layer ceramic plate device24 Feb 2026US 12,558,734 B2Watlow Electric Manufacturing Company
- Methods of preparing metal sheets for a DCB / DAB substrate bonding process10 Feb 2026US 12,545,011 B2Littelfuse, Inc.
- Method for manufacturing bonded body and method for manufacturing insulation circuit substrate8 Jul 2025US 12,356,554 B2Mitsubishi Materials Corporation
- Electric circuit board and power module1 Jul 2025US 12,349,299 B2KYOCERA Corporation
- Joined body, holding device, and electrostatic chuck18 Mar 2025US 12,251,923 B2Niterra Co., Ltd.
- Bonded body13 Aug 2026US 2026/0234066 A1NGK Corporation
- Heat Dissipation Substrate for a Power Semiconductor Module, Manufacturing Method thereof, and Convertor including the same13 Aug 2026US 2026/0239967 A1Lx Semicon Co., Ltd.
- Heat Dissipation Substrate for Power Semiconductor, Power Semiconductor Module including the same, Power Convertor including the same, and Manufacturing method thereof13 Aug 2026US 2026/0239968 A1Lx Semicon Co., Ltd.
- Ceramic substrate, ceramic circuit board, semiconductor device, method for producing slurry, and method for applying release agent1 Jan 2026US 2026/0001819 A1Niterra Materials Co., Ltd.
- Bonded body22 May 2025US 2025/0162950 A1NGK Insulators, Ltd.
Most cited
By later US patents
- Electrostatic chuck having gas cavity and method244US 6,310,755 B1APPLIED Materials.Inc. · 2001
- Composite materials156US 4,055,451 A1977
- Method of making reactive multilayer foil and resulting product95US 6,534,194 B2The Johns Hopkins University · 2003
- Hard sintered compact for a tool94US 5,037,704 ASumitomo Electric Industries, Ltd. · 1991
- Bonded member comprising different materials, and production method thereof65US 6,918,530 B2NGK Insulators, Ltd. · 2005