US 6,918,530 B2Granted

Bonded member comprising different materials, and production method thereof

AssigneeNGK Insulators, Ltd.

InventorsMasayuki Shinkai, Takahiro Ishikawa, Masahiro Kida, Mitsuru Ohta

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Abstract

A bonded member including a ceramic base material 1 and a metallic member 7 which are bonded together, wherein a solder material 5 comprising Au is disposed on the surface of the ceramic base material 1 via an active metal layer, the active metal layer and the solder material 5 are molten by heating so as to form a precoat layer 6, the metallic member 7 is disposed on the surface of the precoat layer 6 via an insertion metal layer comprising pure metal which may form an alloy having a lower melting point than Au with Au or an alloy of the pure metal and Au, and the insertion metal layer and at least a portion in the vicinity of the interface between the insertion metal layer and the precoat layer 6 are molten by heating to bond the metallic member 7 and the precoat layer 6.

Claims16

Dependent claims

A method for producing a bonded member by bonding a ceramic base material and a metallic member together, the method comprising the steps of:

disposing a solder material comprising Au on a surface of the ceramic base material via an active metal layer,
melting the active metal layer and the solder material by heating so as to form a precoat layer,
disposing the metallic member on a surface of the precoat layer via an insertion metal layer comprising a pure metal which forms an alloy with the precoat layer and has a lower melting point than Au, or an alloy of the pure metal and Au, and
melting the insertion metal layer and at least a portion in the vicinity of the interface between the insertion metal layer and the precoat layer by heating so as to bond the metallic member and the precoat layer together, thereby bonding the ceramic base material and the metallic member together with a formation of a bonding layer.

1 more element

Dependencies are inferred from the claim text.

Facts

Application: 10/348,471Filed 21 Jan 2003
Priority: JP 2002-01775625 Jan 2002
Published: US 2003/0141345 A131 Jul 2003
Granted: 19 Jul 2005
Term ends: Not estimatedThe source records don’t support an estimate.

Classification38 codes

C04B 37/026
Characterised by the interlayer used: consisting of metals or metal salts
B23K 1/0008
Soldering, e.g. brazing, or unsoldering: specially adapted for particular articles or work
B23K 1/19
Soldering, e.g. brazing, or unsoldering: taking account of the properties of the materials to be soldered
B23K 1/20
Soldering, e.g. brazing, or unsoldering: preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating