B81C 2203/0792
Forming interconnections between the electronic processing unit and the micromechanical structure
B81C2203/0792 (Forming interconnections between the electronic processing unit and the micromechanical structure) appears on 406 US grants and 472 published applications in this corpus.
Search patents in B81C- Granted patents
- 406
- Published applications
- 472
- Assignees
- 129
- Inventors
- 716
- Latest grant
- 11 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2003 | 0 | 1 |
| 2004 | 0 | 0 |
| 2005 | 0 | 1 |
| 2006 | 1 | 1 |
| 2007 | 1 | 2 |
| 2008 | 1 | 1 |
| 2009 | 0 | 3 |
| 2010 | 0 | 0 |
| 2011 | 3 | 7 |
| 2012 | 3 | 14 |
| 2013 | 9 | 15 |
| 2014 | 20 | 29 |
| 2015 | 14 | 40 |
| 2016 | 43 | 39 |
| 2017 | 45 | 56 |
| 2018 | 37 | 48 |
| 2019 | 55 | 36 |
| 2020 | 40 | 42 |
| 2021 | 23 | 29 |
| 2022 | 33 | 34 |
| 2023 | 29 | 24 |
| 2024 | 15 | 17 |
| 2025 | 24 | 20 |
| 2026 | 10 | 13 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- MEMS pressure sensor11 Aug 2026US 12,704,427 B2MEI Micro, Inc.
- MEMS loudspeaker manufacturing method and MEMS loudspeaker21 Jul 2026US 12,686,614 B2Aac Kaitai Technologies (Wuhan) Co., Ltd
- Process flow for thin contactless thermal sensors16 Jun 2026US 12,656,179 B2STMicroelectronics International N. V.
- Micro-electro-mechanical system (MEMS) device and fabrication method thereof19 May 2026US 12,630,416 B2Vanguard International Semiconductor Corporation
- Production method for a micromechanical sensor apparatus, and corresponding micromechanical sensor apparatus19 May 2026US 12,630,419 B2Robert Bosch GmbH
- Packaging method for mems acoustic device structure, mems acoustic device packaging structure and mems chip packaging method for acoustic device8 Oct 2026US 2026/0307982 A1Hefei Smat Technology Co., Ltd.
- Process flow for thin contactless thermal sensors17 Sep 2026US 2026/0276451 A1STMicroelectronics International N. V.
- Asic capped mems device20 Aug 2026US 2026/0242209 A1Murata Manufacturing Co., Ltd.
- Micro-electro-mechanical system package20 Aug 2026US 2026/0242212 A1Vanguard International Semiconductor Corporation
- Asic capped double layer mems platform20 Aug 2026US 2026/0242213 A1Murata Manufacturing Co., Ltd.
Most cited
By later US patents
- MEMS and CMOS integration with low-temperature bonding243US 9,394,161 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Method of fabrication of a AL/GE bonding in a wafer packaging environment and a product produced therefrom155US 7,442,570 B2Invensence Inc. · 2008
- Microfabricated ultrasonic transducers and related apparatus and methods123US 9,067,779 B1Butterfly Network, Inc. · 2015
- Support structure for TSV in MEMS structure52US 9,085,456 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Microfabricated ultrasonic transducers and related apparatus and methods43US 9,394,162 B2Butterfly Network, Inc. · 2016