B81C 2203/0771
Stacking the electronic processing unit and the micromechanical structure
B81C2203/0771 (Stacking the electronic processing unit and the micromechanical structure) appears on 146 US grants and 179 published applications in this corpus.
Search patents in B81C- Granted patents
- 146
- Published applications
- 179
- Assignees
- 68
- Inventors
- 263
- Latest grant
- 23 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2004 | 0 | 1 |
| 2005 | 1 | 1 |
| 2006 | 0 | 0 |
| 2007 | 0 | 1 |
| 2008 | 1 | 6 |
| 2009 | 0 | 3 |
| 2010 | 0 | 1 |
| 2011 | 3 | 8 |
| 2012 | 6 | 5 |
| 2013 | 4 | 12 |
| 2014 | 10 | 18 |
| 2015 | 13 | 12 |
| 2016 | 20 | 16 |
| 2017 | 13 | 9 |
| 2018 | 8 | 18 |
| 2019 | 18 | 14 |
| 2020 | 12 | 11 |
| 2021 | 8 | 8 |
| 2022 | 5 | 8 |
| 2023 | 9 | 6 |
| 2024 | 5 | 10 |
| 2025 | 7 | 9 |
| 2026 | 3 | 2 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Decoupling method for semiconductor device23 Jun 2026US 12,662,371 B2STMicroelectronics International N. V.
- Stacked die package and methods of forming the same23 Jun 2026US 12,667,009 B2Qorvo US, Inc.
- CMOS ultrasonic transducers and related apparatus and methods10 Mar 2026US 12,569,880 B2Bfly Operations, Inc.
- Electronic device and method of fabricating the same28 Oct 2025US 12,454,454 B2Beijing Boe Optoelectronics Technology Co., Ltd.
- System and method for MEMS devices9 Sep 2025US 12,411,337 B2Texas Instruments Incorporated
- Stacked die package and methods of forming the same17 Sep 2026US 2026/0283037 A1Qorvo US, Inc.
- Cmos ultrasonic transducers and related apparatus and methods9 Jul 2026US 2026/0192332 A1Bfly Operations, Inc.
- System and method for mems devices27 Nov 2025US 2025/0362491 A1Texas Instruments Incorporated
- Power gating using nanoelectromechanical systems (nems) in back end of line (beol)20 Nov 2025US 2025/0359319 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Monolithic Microelectromechanical Systems Based Spatial Light Modulators Including Ribbon-Type Modulators23 Oct 2025US 2025/0326629 A1Silicon Light Machines Corporation
Most cited
By later US patents
- Vertical system integration289US 7,402,897 B2Elm Technology Corporation · 2008
- Planar microshells for vacuum encapsulated devices and damascene method of manufacture94US 7,923,790 B1Silicon Laboratories Inc. · 2011
- Complementary metal oxide semiconductor (CMOS) ultrasonic transducers and methods for forming the same74US 9,242,275 B2Butterfly Networks, Inc. · 2016
- Ultrasonic transducers in complementary metal oxide semiconductor (CMOS) wafers and related apparatus and methods55US 9,505,030 B2Butterfly Network, Inc. · 2016
- CMOS ultrasonic transducers and related apparatus and methods54US 9,499,392 B2Butterfly Network, Inc. · 2016