US 12,454,454 B2Granted

Electronic device and method of fabricating the same

AssigneesBeijing Boe Optoelectronics Technology Co., Ltd., Beijing BOE Technology Development Co., Ltd.

InventorsHao Yan, Yulin Feng, Yue Li, Chuncheng Che

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Abstract

An electronic device includes a substrate having a first surface and a second surface opposite to each other in a thickness direction of the substrate, wherein the substrate has first and second connection vias which penetrate through the substrate in the thickness direction of the substrate, and first and second conductive pillars are respectively in the first connection via and the second connection via; a switch on the first surface of the substrate and comprising first and second signal electrodes, wherein the first signal electrode is electrically coupled to a first terminal of the first conductive pillar, and the second signal electrode is electrically coupled to a first terminal of the second conductive pillar; and a filter on the second surface of the substrate.

Claims18

Dependent claims

An electronic device, comprising:

a substrate having a first surface and a second surface opposite to each other in a thickness direction of the substrate, wherein the substrate has a first connection via and a second connection via which penetrate through the substrate in the thickness direction of the substrate, and a first conductive pillar and a second conductive pillar are respectively in the first connection via and the second connection via;
a switch on the first surface of the substrate and comprising a first signal electrode and a second signal electrode, wherein the first signal electrode is electrically coupled to a first terminal of the first conductive pillar, and the second signal electrode is electrically coupled to a first terminal of the second conductive pillar;
and
a filter on the second surface of the substrate, wherein an input terminal of the filter is electrically coupled to a second terminal of the second conductive pillar, and an output terminal of the filter is electrically coupled to a second conductive ball of the electronic device, and a second terminal of the first conductive pillar is electrically coupled to a first conductive ball of the electronic device,
wherein the switch further comprises a cantilever,
a first terminal of the cantilever is electrically coupled to the first signal electrode;
a second terminal of the cantilever is electrically coupled to the second signal electrode in response to an on state of the switch;
and the second terminal of the cantilever is disconnected from the second signal electrode in response to an off state of the switch, and
the electronic device further comprises a contact passivation layer on a first surface of the second signal electrode, wherein the contact passivation layer is below the cantilever;
and the second terminal of the cantilever is in contact with the contact passivation layer in response to the on state of the switch.

7 more elements

A method of fabricating an electronic device, comprising:

providing a substrate, wherein the substrate has a first surface and a second surface opposite to each other in a thickness direction of the substrate, and the substrate has a first connection via and a second connection via which penetrate through the substrate in the thickness direction of the substrate;
filling the first connection via and the second connection via with a conductive material, to obtain a first conductive pillar and a second conductive pillar respectively;
fabricating a switch on the first surface of the substrate, wherein a first signal electrode of the switch is electrically coupled to a first terminal of the first conductive pillar, and a second signal electrode of the switch is electrically coupled to a first terminal of the second conductive pillar;
and
fabricating a filter on the second surface of the substrate, wherein an input terminal of the filter is electrically coupled to a second terminal of the second conductive pillar, and an output terminal of the filter is electrically coupled to a second conductive ball of the electronic device, and a second terminal of the first conductive pillar is electrically coupled to a first conductive ball of the electronic device,
wherein the switch further comprises a cantilever,
a first terminal of the cantilever is electrically coupled to the first signal electrode;
a second terminal of the cantilever is electrically coupled to the second signal electrode in response to an on state of the switch;
and the second terminal of the cantilever is disconnected from the second signal electrode in response to an off state of the switch, and
the electronic device further comprises a contact passivation layer on a first surface of the second signal electrode, wherein the contact passivation layer is below the cantilever;
and the second terminal of the cantilever is in contact with the contact passivation layer in response to the on state of the switch.

8 more elements

Dependencies are inferred from the claim text.

Facts

Application: 18/022,145Filed 31 Mar 2022
Published: US 2024/0270566 A115 Aug 2024
Granted: 28 Oct 2025
Term ends: Not estimatedThe source records don’t support an estimate.

Classification15 codes

B81B 7/0006
Microstructural systems ; Auxiliary parts of microstructural devices or systems: interconnects
B81C 1/00246
Integrating an electronic processing unit with a micromechanical structure: monolithic integration, i.e. micromechanical structure and electronic…
B81C 99/00
Subject matter not provided for in other groups of this subclass
H05K 1/0306
Use of materials for the substrate: inorganic insulating substrates, e.g. ceramic, glass