B81C 2203/0721
Forming the micromechanical structure with a low-temperature process
Official title: Forming the micromechanical structure with a low-temperature process (B81C2203/0735 takes precedence)
B81C2203/0721 (Forming the micromechanical structure with a low-temperature process) appears on 14 US grants and 11 published applications in this corpus.
Search patents in B81C- Granted patents
- 14
- Published applications
- 11
- Assignees
- 10
- Inventors
- 22
- Latest grant
- 17 Dec 2024
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| Year | Granted patents | Published applications |
|---|---|---|
| 2008 | 0 | 1 |
| 2009 | 0 | 0 |
| 2010 | 1 | 0 |
| 2011 | 1 | 4 |
| 2012 | 3 | 0 |
| 2013 | 0 | 0 |
| 2014 | 1 | 0 |
| 2015 | 1 | 3 |
| 2016 | 2 | 0 |
| 2017 | 2 | 1 |
| 2018 | 1 | 0 |
| 2019 | 0 | 0 |
| 2020 | 0 | 0 |
| 2021 | 0 | 0 |
| 2022 | 0 | 2 |
| 2023 | 1 | 0 |
| 2024 | 1 | 0 |
By publication year.
Recent patents
- Monolithic post complementary metal-oxide-semiconductor integration of thermoelectric-based infrared detector17 Dec 2024US 12,168,603 B2Meridian Innovation Pte Ltd
- Heterogenous integration of complementary metal-oxide-semiconductor and MEMS sensors19 Dec 2023US 11,845,653 B2Meridian Innovation Pte Ltd
- Display device, method of manufacturing the same, display method, and wearable device24 Apr 2018US 9,954,037 B2Boe Technology Group Co., Ltd.
- Sensor device and method for making thereof6 Jun 2017US 9,670,057 B1Infineon Technologies AG
- Sensor device and method for making thereof9 May 2017US 9,643,837 B1Infineon Technologies AG
- Monolithic post complementary metal-oxide-semiconductor integration of thermoelectric-based infrared detector16 Jun 2022US 2022/0185660 A1Meridian Innovation Pte Ltd
- Heterogenous integration of complementary metal-oxide-semiconductor and mems sensors26 May 2022US 2022/0162062 A1Meridian Innovation Pte Ltd
- Display device, method of manufacturing the same, display method, and wearable device13 Apr 2017US 2017/0104041 A1Boe Technology Group Co., Ltd.
- Micromechanical system and method for manufacturing a micromechanical system31 Dec 2015US 2015/0375998 A1Infineon Technologies Dresden GmbH
- Micromechanical system and method for manufacturing a micromechanical system31 Dec 2015US 2015/0375999 A1Infineon Technologies Dresden GmbH
Most cited
By later US patents
- Planar microshells for vacuum encapsulated devices and damascene method of manufacture94US 7,923,790 B1Silicon Laboratories Inc. · 2011
- Microshells with integrated getter layer25US 8,288,835 B2Silicon Laboratories Inc. · 2012
- Planar microshells for vacuum encapsulated devices and damascene method of manufacture20US 8,313,970 B2Silicon Laboratories Inc. · 2012
- Micromechanical system and method for manufacturing a micromechanical system10US 9,382,111 B2Infineon Technologies Dresden GmbH · 2016
- Planar microshells for vacuum encapsulated devices and damascene method of manufacture9US 8,273,594 B2Silicon Laboratories Inc. · 2012