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US 9,670,057 B1Granted
Sensor device and method for making thereof
AssigneeInfineon Technologies AG
InventorMarten Oldsen
Life of this patent
Estimating the term…
Abstract
A sensor device may include an electronic device that has at least one integrated circuit device and a MEMS sensor that are each monolithically integrated with a semiconductor substrate. The sensor device may include a suspension structure that suspends the MEMS sensor over a back cavity within the semiconductor substrate. The suspension structure may be springs or a spring structure formed from etching the front side of the substrate.
Claims17
A sensor device, comprising:
- an electronic device, comprising:
- a semiconductor substrate comprising at least one integrated circuit and a MEMS sensor, the MEMS sensor including a membrane,
- a back cavity within the semiconductor substrate arranged below the MEMS sensor and extending to a back side of the semiconductor substrate, and
- a suspension structure suspending at least the membrane of the MEMS sensor in the semiconductor substrate;
- a molding partially encapsulating the semiconductor substrate;
- and
- a sensor port comprising an opening in the molding at a front side of the substrate exposing at least the MEMS sensor membrane to an environment outside the sensor device,
- wherein the at least one integrated circuit comprises an application specific integrated circuit (ASIC).
5 more elements
A method for manufacturing a sensor device, comprising:
- providing a semiconductor substrate comprising at least on integrated circuit and a MEMS sensor each monolithically formed at a first side of the semiconductor substrate;
- forming a back cavity within the semiconductor substrate below the MEMS sensor and extending to a back side of the semiconductor substrate,
- forming a suspension structure from the semiconductor substrate, wherein the suspension structure suspends at least a membrane of the MEMS sensor in the semiconductor substrate;
- and
- forming a sensor port by at least partially encapsulating the substrate with a mold, the sensor port providing an opening in the mold to the first side of the substrate and
- exposing at least the MEMS sensor membrane to an environment outside the sensor device,
- wherein the at least one integrated circuit comprises an application specific integrated circuit (ASIC).
4 more elements
Dependencies are inferred from the claim text.