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US 9,643,837 B1Granted
Sensor device and method for making thereof
AssigneeInfineon Technologies AG
InventorMatthias Friedrich Herrmann
Life of this patent
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Abstract
A sensor device may include an electronic device that has at least one integrated circuit device and a MEMS sensor that are each monolithically integrated with a semiconductor substrate. The sensor device may include a suspension structure that suspends the MEMS sensor over a back cavity within the semiconductor substrate. The suspension structure may be springs or a spring structure formed from etching the front side of the substrate.
Claims20
A device, comprising:
- a semiconductor substrate comprising a MEMS device;
- a back cavity within the semiconductor substrate arranged below the MEMS device, and
- a suspension structure suspending and providing mechanical decoupling to at least a portion of the MEMS device in the semiconductor substrate, wherein the suspension structure comprises one or more springs, wherein the one or more springs are defined by one or more trenches formed within the semiconductor substrate,
- wherein at least one spring of the one or more springs comprises at least one L-shape spring portion, wherein the at least one L-shape spring portion at least partially surrounds a periphery of the MEMS device.
1 more element
A device, comprising:
- a semiconductor substrate comprising a MEMS device, wherein the MEMS device is monolithically integrated within the substrate;
- a back cavity within the semiconductor substrate arranged below the MEMS device, and
- a suspension structure suspending and providing mechanical decoupling to at least a portion of the MEMS device in the semiconductor substrate, wherein the suspension structure comprises a plurality of springs, wherein the plurality of springs are defined by one or more trenches formed within the semiconductor substrate,
- wherein each of the plurality of springs comprises a first spring portion, a second spring portion, and a third spring portion, wherein the first spring portion is joined to the second spring portion at a substantially right angle and further and wherein the third spring portion extends in a direction parallel to a direction either the first spring portion or the second spring portion extends, and
- wherein the plurality of springs is arranged in an intertwined spiral pattern.
2 more elements
A device, comprising:
- a semiconductor substrate comprising a MEMS device;
- a back cavity within the semiconductor substrate arranged below the MEMS device, and
- a suspension structure suspending and providing mechanical decoupling to at least a portion of the MEMS device in the semiconductor substrate, wherein the suspension structure comprises one or more springs, wherein the one or more springs are defined by one or more trenches formed within the semiconductor substrate,
- wherein at least one spring of the one or more springs comprises at least one L-shape spring portion,
- wherein the at least one spring comprising the at least one L-shape spring portion further comprises a section extending from the L-shape spring portion to the MEMS device.
2 more elements
A device, comprising:
- a semiconductor substrate comprising a MEMS device;
- a back cavity within the semiconductor substrate arranged below the MEMS device, and
- a suspension structure suspending and providing mechanical decoupling to at least a portion of the MEMS device in the semiconductor substrate, wherein the suspension structure comprises one or more springs, wherein the one or more springs are defined by one or more trenches formed within the semiconductor substrate,
- wherein at least one spring of the one or more springs comprises at least one L-shape spring portion,
- wherein the at least one spring comprising the at least one L-shape spring portion further comprises a further section extending from the L-shape spring portion to the semiconductor substrate.
2 more elements
A device, comprising:
- a semiconductor substrate comprising a MEMS device, wherein the MEMS device is monolithically integrated within the substrate;
- a back cavity within the semiconductor substrate arranged below the MEMS device, and
- a suspension structure suspending and providing mechanical decoupling to at least a portion of the MEMS device in the semiconductor substrate, wherein the suspension structure comprises a plurality of springs, wherein the plurality of springs are defined by one or more trenches formed within the semiconductor substrate,
- wherein each of the plurality of springs comprises a first spring portion, a second spring portion, and a third spring portion, wherein the first spring portion is joined to the second spring portion at a substantially right angle and further and wherein the third spring portion extends in a direction parallel to a direction either the first spring portion or the second spring portion extends, and
- wherein each of the plurality of springs comprises a first fold and a second fold, wherein the first fold and the second fold each comprises a set of two spring portions parallel to each other and separated from each other by a gap, and wherein for each spring, the set of two spring portions of the first fold is perpendicular to the set of two spring portions of the second fold.
2 more elements
Dependencies are inferred from the claim text.