B81C 2203/019
Characterised by the material or arrangement of seals between parts
Official title: characterised by the material or arrangement of seals between parts
B81C2203/019 (Characterised by the material or arrangement of seals between parts) appears on 389 US grants and 486 published applications in this corpus.
Search patents in B81C- Granted patents
- 389
- Published applications
- 486
- Assignees
- 174
- Inventors
- 857
- Latest grant
- 19 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 2 | 0 |
| 2000 | 1 | 0 |
| 2001 | 1 | 0 |
| 2002 | 2 | 5 |
| 2003 | 8 | 7 |
| 2004 | 5 | 13 |
| 2005 | 11 | 27 |
| 2006 | 13 | 25 |
| 2007 | 14 | 30 |
| 2008 | 12 | 18 |
| 2009 | 14 | 16 |
| 2010 | 20 | 28 |
| 2011 | 19 | 14 |
| 2012 | 13 | 31 |
| 2013 | 21 | 21 |
| 2014 | 26 | 21 |
| 2015 | 20 | 24 |
| 2016 | 22 | 27 |
| 2017 | 29 | 36 |
| 2018 | 21 | 17 |
| 2019 | 22 | 19 |
| 2020 | 24 | 28 |
| 2021 | 14 | 14 |
| 2022 | 10 | 10 |
| 2023 | 16 | 19 |
| 2024 | 8 | 10 |
| 2025 | 12 | 16 |
| 2026 | 7 | 10 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Inertial sensor, method for manufacturing inertial sensor, and inertial measurement unit19 May 2026US 12,631,665 B2Seiko Epson Corporation
- Methods of manufacturing plasma generating cells for a plasma source14 Apr 2026US 12,601,621 B2APPLIED Materials.Inc.
- Method for manufacturing semiconductor structure17 Mar 2026US 12,577,099 B2Taiwan Semiconductor Manufacturing Company.Ltd
- High reliability sensor24 Feb 2026US 12,559,363 B2Texas Instruments Incorporated
- Sensor assembly and methods of manufacturing thereof17 Feb 2026US 12,553,751 B2APPLIED Materials.Inc.
- Deformation Bonded and Hermetically Sealed Vacuum MEMS Cells with Stopping Layer17 Sep 2026US 2026/0274653 A1HRL Laboratories, LLC
- Manufacturing process of a microelectromechanical system with multiple cavities at different pressures and related microelectromechanical system20 Aug 2026US 2026/0242215 A1STMicroelectronics International N. V.
- Airtight structure, method for manufacturing same, and base resin composition for maintaining airtightness13 Aug 2026US 2026/0233988 A1Resonac Corporation
- Methods of manufacturing plasma generating cells for a plasma source16 Jul 2026US 2026/0202227 A1APPLIED Materials.Inc.
- High-Vacuum Micro-Vacuum Cells2 Apr 2026US 2026/0091973 A1HRL Laboratories, LLC
Most cited
By later US patents
- Hermetic seal and method to create the same666US 6,589,625 B1Iridigm Display Corporation · 2003
- Method of room temperature covalent bonding315US 7,109,092 B2Ziptronix, Inc. · 2006
- Method and structure for wafer to wafer bonding in semiconductor packaging237US 8,377,798 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2013
- Method for packaging microsensors228US 6,140,144 AIntegrated Sensing Systems, Inc. · 2000
- Method of room temperature covalent bonding215US 8,841,002 B2Ziptronix, Inc. · 2014