B81C 2201/053
Depositing a protective layers
B81C2201/053 (Depositing a protective layers) appears on 189 US grants and 185 published applications in this corpus.
Search patents in B81C- Granted patents
- 189
- Published applications
- 185
- Assignees
- 102
- Inventors
- 456
- Latest grant
- 8 Apr 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 2 | 0 |
| 1998 | 6 | 0 |
| 1999 | 2 | 0 |
| 2000 | 6 | 0 |
| 2001 | 5 | 4 |
| 2002 | 6 | 8 |
| 2003 | 6 | 6 |
| 2004 | 6 | 10 |
| 2005 | 5 | 7 |
| 2006 | 9 | 11 |
| 2007 | 6 | 5 |
| 2008 | 3 | 1 |
| 2009 | 1 | 6 |
| 2010 | 3 | 5 |
| 2011 | 5 | 6 |
| 2012 | 2 | 6 |
| 2013 | 5 | 6 |
| 2014 | 8 | 9 |
| 2015 | 7 | 11 |
| 2016 | 10 | 15 |
| 2017 | 12 | 20 |
| 2018 | 20 | 16 |
| 2019 | 15 | 4 |
| 2020 | 11 | 6 |
| 2021 | 4 | 7 |
| 2022 | 7 | 4 |
| 2023 | 6 | 4 |
| 2024 | 4 | 3 |
| 2025 | 2 | 2 |
| 2026 | 0 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Dielectric protection layer configured to increase performance of mems device8 Apr 2025US 12,269,735 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Method for etching gaps of unequal width7 Jan 2025US 12,187,605 B2Murata Manufacturing Co., Ltd.
- Microfluidic chip and fabrication method5 Nov 2024US 12,134,097 B2Shanghai Tianma Micro-Electronics Co., Ltd.
- Method with mechanical dicing process for producing MEMS components13 Aug 2024US 12,060,266 B2Infineon Technologies AG
- Microelectromechanical microphone with membrane trench reinforcements and method of fabrication18 Jun 2024US 12,012,326 B2TDK Corporation
- Method for manufacturing an electronic device11 Jun 2026US 2026/0159381 A1Commissariat A L' Energie Atomique Et Aux Energies Alternatives
- Methods for post-processing and for handling of mems chips26 Mar 2026US 2026/0084957 A1
- Method for producing a mems mirror array, and mems mirror array15 Jan 2026US 2026/0015226 A1
- Method and carrier substrate for producing a semiconductor component2 Oct 2025US 2025/0308911 A1Jenoptik Optical System GmbH
- Method for processing silicon substrate and method for processing liquid ejection head substrate30 Jan 2025US 2025/0033956 A1Canon Kabushiki Kaisha
Most cited
By later US patents
- Microstructures and single mask, single-crystal process for fabrication thereof160US 5,719,073 ACornell Research Foundation, Inc. · 1998
- Electrically isolated released microstructures133US 5,847,454 ACornell Research Foundcatton, Inc. · 1998
- Microstructure and single mask, single-crystal process for fabrication thereof117US 5,846,849 ACornell Research Foundation, Inc. · 1998
- Encapsulants for protecting MEMS devices during post-packaging release etch116US 6,956,283 B12005
- RIE process for fabricating submicron, silicon electromechanical structures110US 5,198,390 ACornell Research Foundation, Inc. · 1993