B81C 2201/05
Temporary protection of devices or parts of the devices during manufacturing
B81C2201/05 (Temporary protection of devices or parts of the devices during manufacturing) appears on 248 US grants and 247 published applications in this corpus.
Search patents in B81C- Granted patents
- 248
- Published applications
- 247
- Assignees
- 131
- Inventors
- 572
- Latest grant
- 4 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 2 | 0 |
| 1994 | 2 | 0 |
| 1995 | 0 | 0 |
| 1996 | 2 | 0 |
| 1997 | 2 | 0 |
| 1998 | 6 | 0 |
| 1999 | 2 | 0 |
| 2000 | 6 | 0 |
| 2001 | 6 | 4 |
| 2002 | 9 | 11 |
| 2003 | 8 | 9 |
| 2004 | 7 | 12 |
| 2005 | 7 | 8 |
| 2006 | 9 | 13 |
| 2007 | 6 | 5 |
| 2008 | 5 | 2 |
| 2009 | 1 | 9 |
| 2010 | 3 | 8 |
| 2011 | 6 | 6 |
| 2012 | 4 | 6 |
| 2013 | 7 | 8 |
| 2014 | 9 | 11 |
| 2015 | 9 | 13 |
| 2016 | 16 | 22 |
| 2017 | 18 | 29 |
| 2018 | 26 | 21 |
| 2019 | 23 | 7 |
| 2020 | 14 | 6 |
| 2021 | 5 | 8 |
| 2022 | 8 | 6 |
| 2023 | 7 | 6 |
| 2024 | 5 | 7 |
| 2025 | 3 | 4 |
| 2026 | 2 | 6 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- MEMS device manufacturing method4 Aug 2026US 12,698,203 B2Commissariat A L' Energie Atomique Et Aux Energies Alternatives
- Foundry-compatible through silicon via process for integrated micro-speaker and microphone6 Jan 2026US 12,515,943 B2Vibrant Microsystems Inc.
- Dielectric protection layer configured to increase performance of mems device8 Apr 2025US 12,269,735 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Top notch slit profile for MEMS device25 Feb 2025US 12,238,478 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Method for etching gaps of unequal width7 Jan 2025US 12,187,605 B2Murata Manufacturing Co., Ltd.
- Method for manufacturing an electronic device11 Jun 2026US 2026/0159381 A1Commissariat A L' Energie Atomique Et Aux Energies Alternatives
- Method for singulating a wafer and suitable device21 May 2026US 2026/0138869 A1Carl Zeiss SMT GmbH
- Methods for post-processing and for handling of mems chips26 Mar 2026US 2026/0084957 A1
- Device encapsulation using physical vapor deposition5 Feb 2026US 2026/0035238 A1
- Method for producing a mems mirror array, and mems mirror array15 Jan 2026US 2026/0015226 A1
Most cited
By later US patents
- Method of fabricating suspended microstructures245US 6,465,355 B1Hewlett-Packard Company · 2002
- Microstructures and single mask, single-crystal process for fabrication thereof160US 5,719,073 ACornell Research Foundation, Inc. · 1998
- Electrically isolated released microstructures133US 5,847,454 ACornell Research Foundcatton, Inc. · 1998
- Microstructure and single mask, single-crystal process for fabrication thereof117US 5,846,849 ACornell Research Foundation, Inc. · 1998
- Encapsulants for protecting MEMS devices during post-packaging release etch116US 6,956,283 B12005