B81C 2201/0198
For making a masking layer
Official title: for making a masking layer
B81C2201/0198 (For making a masking layer) appears on 127 US grants and 157 published applications in this corpus.
Search patents in B81C- Granted patents
- 127
- Published applications
- 157
- Assignees
- 74
- Inventors
- 310
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2004 | 1 | 3 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 1 | 4 |
| 2008 | 0 | 12 |
| 2009 | 3 | 8 |
| 2010 | 3 | 8 |
| 2011 | 4 | 8 |
| 2012 | 6 | 11 |
| 2013 | 21 | 12 |
| 2014 | 9 | 8 |
| 2015 | 5 | 9 |
| 2016 | 11 | 8 |
| 2017 | 8 | 9 |
| 2018 | 9 | 7 |
| 2019 | 6 | 3 |
| 2020 | 6 | 3 |
| 2021 | 1 | 8 |
| 2022 | 5 | 6 |
| 2023 | 4 | 12 |
| 2024 | 8 | 7 |
| 2025 | 9 | 8 |
| 2026 | 7 | 3 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Micro-electro-mechanical system and manufacturing method thereof29 Sep 2026US 12,747,154 B2Beijing BOE Technology Development Co., Ltd.
- Method for producing a micromechanical device comprising a cavity having a melt seal29 Sep 2026US 12,747,156 B2Robert Bosch GmbH
- Method for producing a microelectromechanical component16 Jun 2026US 12,655,018 B2Robert Bosch GmbH
- Biomaterial detection sensor and method of manufacturing the same19 May 2026US 12,631,572 B2Samsung Electronics Co., Ltd.
- Process for manufacturing a microelectromechanical mirror device and microelectromechanical mirror device5 May 2026US 12,619,065 B2STMicroelectronics S,r.l.
- Inertia measurement unit and method for forming the same28 May 2026US 2026/0145931 A1AAC Technologies PTE.Ltd.
- Dielectric stack for microelectromechanical system devices and methods of fabrication thereof30 Apr 2026US 2026/0116740 A1Texas Instruments Incorporated
- Mems microphone and method for manufacturing the same29 Jan 2026US 2026/0028220 A1United Microelectronics Corp.
- Method and system for fabricating a mems device cap11 Dec 2025US 2025/0376371 A1InvenSense, Inc.
- Micro-electromechanical system device including a precision proof mass element and methods for forming the same13 Nov 2025US 2025/0346482 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Sub-lithographic nano interconnect structures, and method for forming same102US 7,553,760 B2International Business Machines Corporation · 2009
- Registered structure formation via the application of directed thermal energy to diblock copolymer films92US 8,083,953 B2Micron Technology, Inc. · 2011
- Method of forming sub-lithographic features using directed self-assembly of polymers69US 8,114,306 B2International Business Machines Corporation · 2012
- Methods using block copolymer self-assembly for sub-lithographic patterning60US 7,964,107 B2Micron Technology, Inc. · 2011
- Crosslinkable graft polymer non-preferentially wetted by polystyrene and polyethylene oxide34US 8,080,615 B2Micron Technology, Inc. · 2011