B81C 2201/0142
Processes for controlling etch progression not provided for in b81c2201/0136 - b81c2201/014
Official title: Processes for controlling etch progression not provided for in B81C2201/0136 - B81C2201/014
B81C2201/0142 (Processes for controlling etch progression not provided for in b81c2201/0136 - b81c2201/014) appears on 52 US grants and 60 published applications in this corpus.
Search patents in B81C- Granted patents
- 52
- Published applications
- 60
- Assignees
- 48
- Inventors
- 142
- Latest grant
- 2 Dec 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1998 | 1 | 0 |
| 1999 | 3 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 1 |
| 2003 | 1 | 4 |
| 2004 | 4 | 3 |
| 2005 | 3 | 1 |
| 2006 | 1 | 5 |
| 2007 | 1 | 2 |
| 2008 | 2 | 4 |
| 2009 | 2 | 1 |
| 2010 | 2 | 0 |
| 2011 | 1 | 2 |
| 2012 | 0 | 2 |
| 2013 | 2 | 2 |
| 2014 | 4 | 6 |
| 2015 | 3 | 1 |
| 2016 | 1 | 2 |
| 2017 | 1 | 2 |
| 2018 | 4 | 4 |
| 2019 | 2 | 2 |
| 2020 | 3 | 3 |
| 2021 | 2 | 4 |
| 2022 | 3 | 1 |
| 2023 | 2 | 3 |
| 2024 | 2 | 2 |
| 2025 | 2 | 2 |
| 2026 | 0 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Cleaning composition with molybdenum etching inhibitor2 Dec 2025US 12,486,581 B2Entegris, Inc.
- Method for manufacturing semiconductor substrate, method for manufacturing damascene wiring structure, semiconductor substrate, and damascene wiring structure7 Jan 2025US 12,187,607 B2Hamamatsu Photonics K.K.
- Microfabrication of omni-view peripheral scanning system12 Mar 2024US 11,926,523 B2Beijing Voyager Technology Co., Ltd.
- Method for manufacturing an integrated MEMS transducer device and integrated MEMS transducer device23 Jan 2024US 11,878,906 B2Sciosense B. V.
- Surface micromachined structures1 Aug 2023US 11,713,243 B2Texas Instruments Incorporated
- Cleaning composition with molybdenum etching inhibitor12 Feb 2026US 2026/0043148 A1Entegris, Inc.
- Method for manufacturing member with recess structure and member with recess structure3 Jul 2025US 2025/0215319 A1AGC Inc.
- MEMS Array Structures for Gyroscopes with High Resonant Frequencies23 Jan 2025US 2025/0026629 A1NXP USA, Inc.
- Semiconductor chip with embedded microfluidic channels and method of fabricating the same27 Jun 2024US 2024/0208806 A1National Taiwan University
- Micro electro mechanical system probe and manufacturing method thereof30 May 2024US 2024/0174512 A1Taiwan Mask Corporation
Most cited
By later US patents
- Method and devices for detecting the end point of plasma process70US 5,980,767 ATokyo Electron Limited · 1999
- Method and devices for detecting the end point of plasma process54US 5,728,253 ATokyo Electron Limited · 1998
- Process for manufacturing micromechanical and microoptomechanical structures with backside metalization26US 6,506,620 B1Microscan Systems, Inc. · 2003
- Method for anisotropic plasma etching of semiconductors21US 6,720,268 B1Robert Bosch GmbH · 2004
- Method for forming finely-structured parts, finely-structured parts formed thereby, and product using such finely-structured part15US 7,525,732 B2NEC Corporation · 2009