Process for manufacturing micromechanical and microoptomechanical structures with backside metalization
AssigneesMicroscan Systems, Inc., Xerox Corporation
InventorsBruce R. Scharf, Joel A. Kubby, Chuang-Chia Lin, Alex T. Tran, Andrew J. Zosel, Peter M. Gulvin, Jingkuang Chen
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Abstract
The present invention provides a micromechanical or microoptomechanical structure produced by a process comprising defining the structure in a single-crystal silicon layer separated by an insulator layer from a substrate layer; selectively etching the single crystal silicon layer; depositing and etching a polysilicon layer on the insulator layer, with remaining polysilicon forming mechanical elements of the structure; metalizing a backside of the structure; and releasing the formed structure.
Claims6
A process for making a micromechanical or microoptomechanical structure in a wafer comprising a single crystal silicon layer bonded to a substrate layer by an insulator layer, the process comprising:
- defining the structure in the single-crystal silicon layer;
- selectively etching the single crystal silicon layer;
- photolithographically patterning and etching the selectively etched single crystal silicon layer and the insulator layer,
- depositing and patterning a polysilicon layer on the insulator layer;
- metalizing a backside of the structure;
- and
- releasing the structure.
Dependencies are inferred from the claim text.