Micro electro mechanical system probe and manufacturing method thereof

A manufacturing method of micro electro mechanical system (MEMS) probe, comprising the steps of:

• a. providing a silicon substrate having a first surface and a second surface opposite to each other, forming a plurality of first-level pin grooves by etching on the second surface;
• b. forming a plurality of second-level pin grooves by etching on the first surface of the silicon substrate, and each of the second-level pin grooves communicating with the corresponding first-level pin groove;
• c. forming a plurality of third-level pin grooves by etching on the first surface, and each of the third-level pin grooves communicating with the corresponding second-level pin groove;
• d. sputtering a conductive layer on inner surface of the first-level pin grooves, the second-level pin grooves, and the third-level pin grooves;
• e. using two electroplating processes to deposit nickel-cobalt-phosphorus alloy on the first-level pin groove to form the tip of the microprobe, and deposit nickel-cobalt alloy on inside of the second-level pin grooves and the third-level pin grooves to form pin head and pin arm of the microprobe;
• f. depositing at least one abutting metal layer on the surface of the microprobe;
• g. using a circuit substrate with a plurality of circuit pads and at least one window, the plurality of circuit pads being distributed close to the window, and the circuit substrate being bonded and fixed by the circuit pads and the abutting metal layer;
• and
• h. removing the silicon substrate and the conductive layer to form MEMS probes, wherein one end of the plurality of microprobes is fixed to the circuit substrate and other end extends to below the window.