Semiconductor chip with embedded microfluidic channels and method of fabricating the same

A semiconductor chip with embedded microfluidic channels, comprising:

• a semiconductor substrate;
• a circuit structure layer, comprising:
• a first metal layer, disposed on a substrate surface of the semiconductor substrate;
• a second metal layer, disposed on the first metal layer along a stacking direction;
• a first insulation layer, disposed between the first metal layer and the second metal layer;
• and
• a plurality of first bridge patterns, penetrating the first insulation layer, and each electrically connected to at least one of the first metal layer and the second metal layer;
• a first microfluidic channel, embedded in the circuit structure layer, and located between the second metal layer and the semiconductor substrate;
• and
• a micro via hole, embedded in the circuit structure layer, and connected to the first microfluidic channel, wherein an extending direction of the micro via hole intersects the substrate surface of the semiconductor substrate and an extending direction of the first microfluidic channel, a first height of the first microfluidic channel along the stacking direction is equal to a first thickness of the first metal layer along the stacking direction, a hole width of the micro via hole along any direction parallel to the substrate surface is equal to a pattern width of each of the first bridge patterns along the any direction parallel to the substrate surface.