B81C 2201/0115
Porous silicon
B81C2201/0115 (Porous silicon) appears on 111 US grants and 109 published applications in this corpus.
Search patents in B81C- Granted patents
- 111
- Published applications
- 109
- Assignees
- 52
- Inventors
- 219
- Latest grant
- 17 Feb 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 3 | 0 |
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 0 |
| 2002 | 2 | 6 |
| 2003 | 4 | 4 |
| 2004 | 5 | 14 |
| 2005 | 4 | 11 |
| 2006 | 2 | 10 |
| 2007 | 9 | 5 |
| 2008 | 9 | 6 |
| 2009 | 8 | 5 |
| 2010 | 9 | 7 |
| 2011 | 5 | 6 |
| 2012 | 5 | 1 |
| 2013 | 6 | 1 |
| 2014 | 1 | 3 |
| 2015 | 5 | 4 |
| 2016 | 4 | 8 |
| 2017 | 2 | 1 |
| 2018 | 6 | 2 |
| 2019 | 2 | 1 |
| 2020 | 4 | 3 |
| 2021 | 2 | 4 |
| 2022 | 2 | 2 |
| 2023 | 1 | 2 |
| 2024 | 3 | 0 |
| 2025 | 1 | 1 |
| 2026 | 2 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method for manufacturing an integrated system including a capacitive pressure sensor and an inertial sensor, and integrated system17 Feb 2026US 12,552,665 B2STMicroelectronics S,r.l.
- Methods of fabricating porous silicon structures6 Jan 2026US 12,516,438 B2The Methodist Hospital
- Method for manufacturing a capacitive pressure sensor and capacitive pressure sensor2 Dec 2025US 12,486,162 B2STMicroelectronics S,r.l.
- Semiconductor device and method for manufacturing a semiconductor device5 Nov 2024US 12,134,556 B2STMicroelectronics International N. V.
- Micromechanical pressure sensor device and a corresponding production method26 Mar 2024US 11,940,346 B2Robert Bosch GmbH
- Mems element for moving a mass element of an acoustic transducer for generating and/or receiving acoustic signals, and acoustic transducer having such a mems element2 Jul 2026US 2026/0189857 A1
- Methods of fabricating porous silicon structures15 Jan 2026US 2026/0015759 A1The Methodist Hospital
- Methods of fabricating porous silicon structures8 May 2025US 2025/0146158 A1The Methodist Hospital
- Method for manufacturing an integrated system including a capacitive pressure sensor and an inertial sensor, and integrated system2 Mar 2023US 2023/0061430 A1STMicroelectronics S,r.l.
- Method for manufacturing a capacitive pressure sensor and capacitive pressure sensor2 Mar 2023US 2023/0064114 A1STMicroelectronics S,r.l.
Most cited
By later US patents
- Method for forming a multilayer structure201US 8,470,689 B2Commissariat A L' Energie Atomique Et Aux Energies Alternatives · 2013
- Method of making a product with a micro or nano sized structure and product158US 7,531,120 B2Aquamarijn Holding B.V. · 2009
- Deposited thin film void-column network materials89US 6,399,177 B1The Penn State Research Foundation · 2002
- Multilayered wafer with thick sacrificial layer using porous silicon or porous silicon oxide and fabrication method thereof71US 6,277,712 B1Samsung Electronics Co., Ltd. · 2001
- Microelectromechanical device and method utilizing a porous surface65US 7,417,784 B2QUALCOMM MEMS Technologies, Inc. · 2008