B81C 1/00341
Processes for manufacturing microsystems not provided for in groups b81c1/00023 - b81c1/00261
Official title: {Processes for manufacturing microsystems not provided for in groups B81C1/00023 - B81C1/00261}
B81C1/00341 (Processes for manufacturing microsystems not provided for in groups b81c1/00023 - b81c1/00261) appears on 68 US grants and 76 published applications in this corpus.
Search patents in B81C- Granted patents
- 68
- Published applications
- 76
- Assignees
- 54
- Inventors
- 143
- Latest grant
- 19 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1999 | 1 | 0 |
| 2000 | 1 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 1 | 0 |
| 2007 | 0 | 3 |
| 2008 | 1 | 0 |
| 2009 | 1 | 0 |
| 2010 | 0 | 0 |
| 2011 | 1 | 4 |
| 2012 | 1 | 1 |
| 2013 | 1 | 4 |
| 2014 | 6 | 7 |
| 2015 | 8 | 14 |
| 2016 | 6 | 7 |
| 2017 | 7 | 3 |
| 2018 | 5 | 4 |
| 2019 | 5 | 4 |
| 2020 | 5 | 3 |
| 2021 | 4 | 4 |
| 2022 | 2 | 2 |
| 2023 | 5 | 6 |
| 2024 | 2 | 3 |
| 2025 | 3 | 4 |
| 2026 | 2 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Micro-electro-mechanical system (MEMS) device and fabrication method thereof19 May 2026US 12,630,416 B2Vanguard International Semiconductor Corporation
- Method for manufacturing an integrated system including a capacitive pressure sensor and an inertial sensor, and integrated system17 Feb 2026US 12,552,665 B2STMicroelectronics S,r.l.
- MEMS chip, manufacturing method thereof, MEMS device, and electronic device18 Nov 2025US 12,473,196 B2Huawei Technologies Co., Ltd.
- MEMS resonator integrated cicruit fabrication22 Jul 2025US 12,365,582 B2SiTime Corporation
- Semiconductor device comprising different types of microelectromechanical systems devices20 May 2025US 12,304,807 B2Taiwan Semiconductor Manufacturing Company, Ltd.
- Integrated device and manufacturing method thereof24 Sep 2026US 2026/0285673 A1Taiwan Semiconductor Manufacturing Company.Ltd
- MEMS Structure with Via-based Thermistor6 Aug 2026US 2026/0225876 A1Stathera IP Holdings Inc.
- Mems sensor arrangement and method for manufacturing a mems sensor arrangement5 Feb 2026US 2026/0035236 A1Infineon Technologies AG
- Stacked-die MEMS resonator16 Oct 2025US 2025/0320116 A1SiTime Corporation
- A semiconductor device comprising different types of microelectromechanical systems devices7 Aug 2025US 2025/0250163 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- MEMS devices and methods of forming the same51US 9,181,083 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Stacked die package for MEMS resonator system26US 8,022,554 B2SiTime Corporation · 2011
- Micromechanical device and method for its production20US 6,046,067 ASiemens Aktiengesellschaft · 2000
- Micromechanical sensor device17US 5,914,520 ASiemens Aktiengesellschaft · 1999
- Stacked die package for MEMS resonator system17US 8,324,729 B2SiTime Corporation · 2012