MEMS Structure with Via-based Thermistor
AssigneeStathera IP Holdings Inc.
InventorsSebastien Lavigne, Qing Zhang, Vahid Tayari
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Abstract
MEMS devices with co-packaged thermistors, methods of fabrication, and methods of measuring temperature of a MEMS device are described. In an embodiment, a MEMS device with co-packaged thermistor includes a device layer which includes a resonator element, and a cap layer bonded to the device layer. In accordance with embodiments, the cap layer includes a via thermistor including a bulk via that extends through a thickness of the cap layer, a resistive plug that extends through the thickness of the cap layer; an insulator liner layer between the bulk via and the resistive plug and a conductive cap covering the plug.
Claims25
A MEMS device with co-packaged thermistor comprising:
- a device layer including a resonator element;
- a cap layer bonded to the device layer, the cap layer including a via thermistor comprised of:
- a bulk via extending through a thickness of the cap layer;
- a resistive plug extending through the thickness of the cap layer;
- and
- an insulator liner layer between the bulk via and the resistive plug;
- and
- a conductive cap covering the resistive plug and a portion of the bulk via;
- a first contact terminal in electrical connection with the bulk via;
- and
- a second contact terminal in electrical connection with the resistive plug.
A method of measuring temperature of a MEMS device:
- measuring voltage across a via thermistor while applying current through the thermistor;
- amplifying the voltage with a voltage amplifier;
- feeding the amplified voltage to an analog-to-digital converter (ADC) to extract a temperature value;
- wherein the MEMS device comprises:
- a device layer;
- and
- a cap layer bonded to the device layer, the cap layer including the via thermistor.
Dependencies are inferred from the claim text.