MEMS chip, manufacturing method thereof, MEMS device, and electronic device

A micro-electro-mechanical systems (MEMS) device, comprising:

• an MEMS chip;
• a base plate;
• and
• a cover plate that covers the base plate and forms packaging space with the base plate;
• wherein the MEMS chip is disposed on the base plate and is located in the packaging space;
• wherein a pin is disposed on the base plate, wherein a first end of the pin is connected to a drive assembly, and a second end of the pin extends out of the packaging space;
• and
• wherein a side that is of the cover plate and that is opposite to the base plate is made of a transparent material;
• wherein the MEMS chip comprises a substrate, a movable assembly, a fastening assembly, and a drive assembly, wherein the fastening assembly is located between the substrate and the movable assembly;
• wherein the movable assembly comprises a fastening portion, a movable portion, and a first support beam, wherein the first support beam is connected to the movable portion and the fastening portion, and wherein a first avoidance slot is disposed in a first face that is of the movable portion and that faces the fastening assembly;
• wherein a boss and a first position limiting pole are disposed on a face that is of the fastening assembly and that faces the movable assembly, wherein the boss is connected to the fastening portion and is configured to support the fastening portion, and wherein the first position limiting pole corresponds to the first avoidance slot;
• and
• wherein the drive assembly is connected to the movable portion, and is configured to drive the movable portion to move.