B81B 2203/0315
Cavities
B81B2203/0315 (Cavities) appears on 738 US grants and 907 published applications in this corpus.
Search patents in B81B- Granted patents
- 738
- Published applications
- 907
- Assignees
- 292
- Inventors
- 1,452
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 3 | 0 |
| 1996 | 3 | 0 |
| 1997 | 4 | 0 |
| 1998 | 8 | 0 |
| 1999 | 4 | 0 |
| 2000 | 5 | 0 |
| 2001 | 1 | 2 |
| 2002 | 9 | 15 |
| 2003 | 10 | 10 |
| 2004 | 14 | 14 |
| 2005 | 4 | 10 |
| 2006 | 7 | 13 |
| 2007 | 10 | 20 |
| 2008 | 9 | 11 |
| 2009 | 7 | 8 |
| 2010 | 13 | 11 |
| 2011 | 9 | 10 |
| 2012 | 12 | 16 |
| 2013 | 11 | 14 |
| 2014 | 16 | 20 |
| 2015 | 14 | 23 |
| 2016 | 31 | 41 |
| 2017 | 41 | 84 |
| 2018 | 53 | 78 |
| 2019 | 67 | 74 |
| 2020 | 83 | 91 |
| 2021 | 57 | 54 |
| 2022 | 55 | 43 |
| 2023 | 47 | 71 |
| 2024 | 40 | 56 |
| 2025 | 36 | 69 |
| 2026 | 51 | 49 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- MEMS structure including a buried cavity with antistiction protuberances, and manufacturing methods thereof6 Oct 2026US 12,753,067 B2STMicroelectronics S,r.l.
- MEMS device6 Oct 2026US 12,753,069 B2Rohm Co., Ltd.
- Microelectromechanical accelerometer with force feedback loop8 Sep 2026US 12,729,108 B2STMicroelectronics International N. V.
- MEMS device with an improved cap and related manufacturing process8 Sep 2026US 12,729,110 B2STMicroelectronics S,r.l.
- PMUT array with resonance frequency tunable due to adjustable embedded cavity1 Sep 2026US 12,724,146 B2STMicroelectronics International N. V.
- Method for producing a microelectromechanical device comprising a cap structure and a microelectromechanical device8 Oct 2026US 2026/0307983 A1
- Mems device1 Oct 2026US 2026/0296877 A1Infineon Technologies AG
- Electronic devices and methods of manufacturing electronic devices1 Oct 2026US 2026/0296878 A1Amkor Technology Singapore Holding Pte. Ltd.
- Micro-electro-mechanical system package and fabrication method thereof1 Oct 2026US 2026/0296879 A1Vanguard International Semiconductor Corporation
- Method of fabricating micro-electro-mechanical system package24 Sep 2026US 2026/0285676 A1Vanguard International Semiconductor Corporation
Most cited
By later US patents
- Method for fabricating a structure for a microelectromechanical systems (MEMS) device722US 6,794,119 B2Iridigm Display Corporation · 2004
- Method of fabricating suspended microstructures245US 6,465,355 B1Hewlett-Packard Company · 2002
- MEMS and CMOS integration with low-temperature bonding243US 9,394,161 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Boron nutride membrane in wafer structure239US 5,270,125 ARedwood Microsystems, Inc. · 1993
- Manufacture of MEMS structures in sealed cavity using dry-release MEMS device encapsulation191US 7,008,812 B1IC Mechanics, Inc. · 2006