B81B 2201/0264
Pressure sensors
B81B2201/0264 (Pressure sensors) appears on 1,145 US grants and 1,354 published applications in this corpus.
Search patents in B81B- Granted patents
- 1,145
- Published applications
- 1,354
- Assignees
- 346
- Inventors
- 1,948
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 2 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 2 | 0 |
| 1997 | 0 | 0 |
| 1998 | 3 | 0 |
| 1999 | 4 | 0 |
| 2000 | 3 | 0 |
| 2001 | 4 | 11 |
| 2002 | 9 | 7 |
| 2003 | 9 | 4 |
| 2004 | 8 | 8 |
| 2005 | 9 | 20 |
| 2006 | 7 | 13 |
| 2007 | 10 | 18 |
| 2008 | 8 | 9 |
| 2009 | 17 | 25 |
| 2010 | 16 | 23 |
| 2011 | 13 | 29 |
| 2012 | 26 | 38 |
| 2013 | 36 | 43 |
| 2014 | 49 | 66 |
| 2015 | 58 | 111 |
| 2016 | 89 | 108 |
| 2017 | 99 | 122 |
| 2018 | 100 | 115 |
| 2019 | 102 | 103 |
| 2020 | 99 | 98 |
| 2021 | 67 | 96 |
| 2022 | 64 | 85 |
| 2023 | 83 | 64 |
| 2024 | 62 | 46 |
| 2025 | 50 | 52 |
| 2026 | 32 | 40 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- MEMS structure including a buried cavity with antistiction protuberances, and manufacturing methods thereof6 Oct 2026US 12,753,067 B2STMicroelectronics S,r.l.
- Device, system, method, and computer product for detecting and evaluating environmental quantities and events with modular approach and variable complexity6 Oct 2026US 12,754,529 B2STMicroelectronics S,r.l.
- Sensing system on chip and the manufacturing method thereof29 Sep 2026US 12,748,006 B2National Tsing Hua University
- Light-based tactile sensing with directional sensitivity22 Sep 2026US 12,742,693 B2The Regents of the University of Michigan
- Protection of sensing element during moulding15 Sep 2026US 12,736,428 B2Melexis Technologies SA
- Method for producing a microelectromechanical device comprising a cap structure and a microelectromechanical device8 Oct 2026US 2026/0307983 A1
- Integrated device and manufacturing method thereof24 Sep 2026US 2026/0285673 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Mems varactor with contact-mode operation24 Sep 2026US 2026/0287445 A1Semtech Corporation
- Wafer level chip scale packaging with sensor10 Sep 2026US 2026/0265047 A1Stmicroelectronics Pte Ltd
- Device and method of manufacturing device10 Sep 2026US 2026/0265048 A1Tazmo Co., Ltd.
Most cited
By later US patents
- MEMS and CMOS integration with low-temperature bonding243US 9,394,161 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Miniature broadband acoustic transducer172US 6,535,460 B2Knowles Electronics, LLC · 2003
- Capacitance pressure sensor161US 6,012,336 ASandia Corporation · 2000
- Capacitive surface micromachined differential pressure sensor112US 5,332,469 AFord Motor Company · 1994
- Method of manufacturing semiconductor device having a pressure sensor111US 4,618,397 AHitachi, Ltd. · 1986