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US 12,748,006 B2Granted
Sensing system on chip and the manufacturing method thereof
AssigneeNational Tsing Hua University
InventorsTung-Lin Chien, Ya-Chu Lee, Wei-Leun Fang
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Abstract
A sensing system on chip (SOC) is disclosed. The sensing system on chip (SOC) includes a substrate, a humidity sensing unit, an air pressure sensing unit and a gas sensing unit. The substrate has a plane. The humidity sensing unit is formed on the substrate. The air pressure sensing unit is formed on the substrate. The gas sensing unit is formed on the substrate, wherein the humidity sensing unit, the air pressure sensing unit and the gas sensing unit are all arranged on the plane.
Claims5
A sensing system on chip (SOC), comprising:
- a substrate built on a CMOS platform;
- a thermometer formed on the substrate;
- a humidity sensing unit formed on the substrate and having a first heating unit and an electrode layer;
- an air pressure sensing unit formed in a double film design on the substrate and including:
- a fixed structure being flat and having a first surface, a second surface opposite to the first surface and a fixed electrode;
- a first film facing the first surface and having a first film electrode, wherein a first cavity is formed between the first film and the fixed structure;
- and
- a second film facing the second surface and having a second film electrode, wherein a second cavity is formed between the second film and the fixed structure;
- and
- a gas sensing unit formed on the substrate and having a second heating unit,
- wherein the humidity sensing unit, the air pressure sensing unit, and the gas sensing unit are horizontally distributed along the substrate, and the second film electrode of the air pressure sensing unit and the electrode layer of the humidity sensing unit are substantially located on the same layer in the sensing SOC.
8 more elements
Dependencies are inferred from the claim text.