B81B 2201/0207
Bolometers
B81B2201/0207 (Bolometers) appears on 71 US grants and 93 published applications in this corpus.
Search patents in B81B- Granted patents
- 71
- Published applications
- 93
- Assignees
- 45
- Inventors
- 155
- Latest grant
- 4 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 1 | 1 |
| 2005 | 0 | 1 |
| 2006 | 0 | 0 |
| 2007 | 1 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 1 |
| 2010 | 0 | 2 |
| 2011 | 3 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 5 |
| 2014 | 2 | 7 |
| 2015 | 5 | 8 |
| 2016 | 9 | 11 |
| 2017 | 7 | 7 |
| 2018 | 10 | 8 |
| 2019 | 9 | 4 |
| 2020 | 2 | 5 |
| 2021 | 4 | 6 |
| 2022 | 7 | 10 |
| 2023 | 2 | 4 |
| 2024 | 2 | 6 |
| 2025 | 3 | 2 |
| 2026 | 3 | 5 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Crossovers for vacuum packaging4 Aug 2026US 12,698,202 B2Obsidian Sensors, Inc.
- Process flow for thin contactless thermal sensors16 Jun 2026US 12,656,179 B2STMicroelectronics International N. V.
- MEMS and NEMS structures13 Jan 2026US 12,522,498 B2Obsidian Sensors, Inc.
- Infrared detector forming method and associated infrared detector23 Dec 2025US 12,504,328 B2Lynred
- Cover for an infrared detector and a method of fabricating a cover for an infrared detector5 Aug 2025US 12,379,534 B2Meridian Innovation Pte Ltd
- Window cavity wafers4 Jun 2026US 2026/0153380 A1Materion Corporation
- Mems and nems structures23 Apr 2026US 2026/0109596 A1Obsidian Sensors, Inc.
- Method for attaching a bridging metal layer in via holes for supporting posts19 Feb 2026US 2026/0048982 A1National Chung Shan Institute of Science and Technology
- Electronic device including a package with a cap coupled to a substrate with an improved resilience to the delamination and related manufacturing process12 Feb 2026US 2026/0047460 A1STMicroelectronics International N. V.
- Mems device manufacturing8 Jan 2026US 2026/0008669 A1Obsidian Sensors, Inc.
Most cited
By later US patents
- Process for fabricating three-dimensional, free-standing microstructures17US 4,849,070 AThe United States of America as represented by the Secretary of the Army · 1989
- Electronic device and method for fabricating the electronic device12US 6,787,387 B2Matsushita Electric Industrial Co., Ltd. · 2004
- Method of manufacturing a micro-electrical-mechanical system with thermally isolated active elements7US 7,989,249 B2Northrop Grumman Systems Corporation · 2011
- Monolithically integrated multi-sensor device on a semiconductor substrate and method therefor6US 9,758,368 B2Versana Micro Inc. · 2017
- Methods for embedding controlled-cavity MEMS package in integration board5US 8,866,237 B2Texas Instruments Incorporated · 2014