MEMS and NEMS structures
AssigneeObsidian Sensors, Inc.
InventorsJohn Hong, Tallis Chang, Edward Chan, Bing Wen, Yaoling Pan, Sean Andrews
Life of this patent
Estimating the term…
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AssigneeObsidian Sensors, Inc.
InventorsJohn Hong, Tallis Chang, Edward Chan, Bing Wen, Yaoling Pan, Sean Andrews
Estimating the term…
An electromechanical systems structure including: providing a stack, including a structural layer extending in a plane, a sidewall layer including a first portion lying in a plane parallel to the structural layer plane and a second portion lying in a plane transverse to the structural layer plane, an etch-stop layer, positioned between the sidewall layer and the structural layer, including an etch-selectivity different from an etch-selectivity of the structural layer and an etch-selectivity of the sidewall layer, and a mold comprising a wall parallel to the sidewall layer's second portion; etching the sidewall layer's first portion to expose the etch-stop layer; removing the mold; etching the etch-stop layer such that the sidewall layer's second portion masks a portion of the etch-stop layer; removing the sidewall layer's second portion; and etching the structural layer such that the portion of the etch-stop layer masks a portion of the structural layer.
A method of manufacturing an electromechanical systems structure comprising:
A method using a lithography process having a lithographic limit, the method comprising:
Dependencies are inferred from the claim text.