Method of manufacturing a micro-electrical-mechanical system with thermally isolated active elements
AssigneeNorthrop Grumman Systems Corporation
InventorsNathan Bluzer, Silai V. Krishnaswamy, Philip C. Smith
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Abstract
A method of manufacturing a micro-electrical-mechanical system with thermally isolated active elements. Such a system may embody a bolometer, which is well suited for detecting electromagnetic radiation between 90 GHz and 30 THz while operating at room temperature. The method also discloses a generalized process for manufacturing circuitry incorporating active and passive micro-electrical-mechanical systems in a silicon wafer.
Claims27
A method of manufacturing a bolometer, comprising:
- providing a silicon-on-insulator wafer having upper and lower silicon layers separated by a buried oxide layer,
- forming a detector in the upper silicon layer of the silicon-on-insulator wafer,
- forming one or more trenches in the upper silicon layer of the silicon-on-insulator wafer around the detector,
- forming active thermal compensation circuitry in an upper region outside the one or more trenches,
- encapsulating the detector using the buried oxide layer,
- releasing the detector using an etchant compatible with the buried oxide layer, and
- providing mechanical support for the detector.
A method of manufacturing a hybrid device combining integrated circuits and micro-electrical-mechanical systems, comprising:
- providing a silicon-on-insulator wafer having upper and lower silicon layers separated by a buried oxide layer,
- forming an active circuit element in the upper silicon layer of the silicon-on-insulator wafer,
- forming one or more trenches in the upper silicon layer of the silicon-on-insulator wafer around the active circuit element,
- encapsulating the active circuit element using the buried oxide layer,
- releasing a portion of the upper silicon layer that contains the active circuit element using an etchant compatible with the buried oxide layer, and
- providing mechanical support for the active circuit element.
Dependencies are inferred from the claim text.