Methods for embedding controlled-cavity MEMS package in integration board
AssigneeTexas Instruments Incorporated
InventorsChristopher D. Manack, Frank Stepniak, Sreenivasan K. Koduri
Life of this patent
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Abstract
An embedded micro-electro-mechanical system (MEMS) (100) comprising a semiconductor chip (101) embedded in an insulating board (120), the chip having a cavity (102) including a radiation sensor MEMS (105), the opening (104) of the cavity at the chip surface covered by a plate (110) transmissive to the radiation (150) sensed by the MEMS. The plate surface remote from the cavity having a bare central area, to be exposed to the radiation sensed by the MEMS in the cavity, and a peripheral area covered by a metal film (111) touching the plate surface and a layer (112) of adhesive stacked on the metal film.
Claims16
An embedded micro-electro-mechanical system (MEMS) comprising:
- a semiconductor chip embedded in an insulating board, the chip having a cavity including a radiation sensor MEMS, the opening of the cavity at the chip surface covered by a plate transmissive to the radiation sensed by the MEMS;
- the plate surface remote from the cavity having a bare central area, to be exposed to the radiation sensed by the MEMS in the cavity, and a peripheral area covered by a metal film touching the plate surface and a layer of adhesive stacked on the metal film.
A method for fabricating a micro-electro-mechanical system (MEMS), comprising the steps of:
- providing a semiconductor chip having a cavity including a radiation sensor MEMS, the opening of the cavity at the chip surface covered by a plate transmissive to the radiation sensed by the MEMS;
- and
- placing a patterned metal film across the plate surface remote from the cavity.
A method for fabricating an embedded micro-electro-mechanical system (MEMS), comprising the steps of:
- providing a chip having a radiation-sensing MEMS in a cavity covered by a plate having a patterned metal film on the plate surface remote from the cavity;
- attaching the chip surface with the metal film onto a patterned conductive foil covered by a layer of adhesive;
- embedding the non-attached chip body in an insulating board;
- and
- removing from the cover plate sequentially portions of the conductive foil, then of the adhesive layer, and then of the metal film, thereby exposing the plate to the radiation to be sensed by the MEMS in the cavity.
Dependencies are inferred from the claim text.