Y10T 29/4916
Simultaneous circuit manufacturing
Y10T29/4916 (Simultaneous circuit manufacturing) appears on 182 US grants and 154 published applications in this corpus.
Search patents in Y10T- Granted patents
- 182
- Published applications
- 154
- Assignees
- 103
- Inventors
- 299
- Latest grant
- 29 Aug 2023
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 2 | 0 |
| 1983 | 2 | 0 |
| 1984 | 1 | 0 |
| 1985 | 2 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 2 | 0 |
| 1991 | 3 | 0 |
| 1992 | 1 | 0 |
| 1993 | 4 | 0 |
| 1994 | 2 | 0 |
| 1995 | 2 | 0 |
| 1996 | 4 | 0 |
| 1997 | 1 | 0 |
| 1998 | 2 | 0 |
| 1999 | 0 | 0 |
| 2000 | 4 | 0 |
| 2001 | 4 | 3 |
| 2002 | 7 | 8 |
| 2003 | 10 | 9 |
| 2004 | 6 | 16 |
| 2005 | 7 | 17 |
| 2006 | 7 | 8 |
| 2007 | 17 | 18 |
| 2008 | 9 | 11 |
| 2009 | 4 | 9 |
| 2010 | 5 | 7 |
| 2011 | 14 | 11 |
| 2012 | 13 | 12 |
| 2013 | 10 | 9 |
| 2014 | 11 | 5 |
| 2015 | 8 | 5 |
| 2016 | 3 | 3 |
| 2017 | 6 | 0 |
| 2018 | 2 | 1 |
| 2019 | 0 | 1 |
| 2020 | 0 | 0 |
| 2021 | 1 | 1 |
| 2022 | 0 | 0 |
| 2023 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Passive devices in package-on-package structures and methods for forming the same29 Aug 2023US 11,742,217 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Passive devices in package-on-package structures and methods for forming the same25 May 2021US 11,018,086 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Method for forming a passive device on a package-on-package structure18 Dec 2018US 10,157,829 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Method of manufacturing a circuit device12 Jun 2018US 9,998,032 B2Semiconductor Components Industries, LLC
- Printed wiring board and method for manufacturing the same7 Nov 2017US 9,814,135 B2Ibiden Co., Ltd.
- Passive Devices in Package-on-Package Structures and Methods for Forming the Same29 Apr 2021US 2021/0125923 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Passive Devices in Package-on-Package Structures and Methods for Forming the Same18 Apr 2019US 2019/0115298 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Method of manufacturing a circuit device4 Jan 2018US 2018/0006578 A1Semiconductor Components Industries, LLC
- Hybrid circuit device25 Aug 2016US 2016/0248344 A1Semiconductor Components Industries, LLC
- Passive Devices in Package-on-Package Structures and Methods for Forming the Same11 Aug 2016US 2016/0233161 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Method of forming a three-dimensional printed circuit assembly211US 5,264,061 AMotorola, Inc. · 1993
- Injection molded printed circuits132US 5,220,488 AUFE Incorporated · 1993
- Printed circuit board having an injection molded substrate127US 4,996,391 ASiemens Aktiengesellschaft · 1991
- Methods for fabricating flexible circuit structures99US 6,391,220 B1Fujitsu Limited · 2002
- Fabrication of a printed circuit board with metal-filled channels97US 4,532,152 A1985