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US 11,742,217 B2Granted
Passive devices in package-on-package structures and methods for forming the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChih-Hua Chen, Chen-Shien Chen
Life of this patent
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Abstract
A device includes a polymer. A device die is disposed in the polymer. A passive device includes three Through Assembly Vias (TAVs) penetrating through the polymer, wherein the TAVs are coupled in series. A Redistribution Line (RDL) is underlying the polymer. The RDL electrically couples a first one of the TAVs to a second one of the TAVs.
Claims20
A structure comprising:
- a first interconnect structure comprising:
- a first dielectric layer;
- and
- a first redistribution layer in the first dielectric layer;
- a package component disposed over the first interconnect structure;
- and
- a coil comprising a part in the first redistribution layer, wherein the coil is electrically connecting to the package component.
4 more elements
A structure comprising:
- a first package component comprising;
- a first interconnect structure comprising:
- a first plurality of dielectric layers;
- and
- a first plurality of redistribution layers in the first plurality of dielectric layers;
- a package component disposed over the first interconnect structure;
- a plurality of through-vias over the first interconnect structure;
- an encapsulant encapsulating the package component and the plurality of through-vias therein;
- and
- a coil comprising a part in the first plurality of redistribution layers, wherein the coil is electrically connected to the package component.
7 more elements
A structure comprising:
- a coil;
- a device die electrically connected to the coil;
- a first plurality of dielectric layers;
- a first plurality of redistribution layers in the first plurality of dielectric layers, wherein the coil extends into the first plurality of redistribution layers, and wherein a first redistribution line in the first plurality of redistribution layers electrically connects the coil to the device die;
- and
- a molding compound molding the device die therein, with the first redistribution line in the first plurality of redistribution layers being in physical contact with the molding compound.
3 more elements
Dependencies are inferred from the claim text.