Y10T 29/49124
On flat or curved insulated base
Official title: On flat or curved insulated base, e.g., printed circuit, etc.
Y10T29/49124 (On flat or curved insulated base) appears on 20,277 US grants and 17,209 published applications in this corpus.
Search patents in Y10T- Granted patents
- 20,277
- Published applications
- 17,209
- Assignees
- 4,449
- Inventors
- 28,851
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 51 | 0 |
| 1977 | 47 | 0 |
| 1978 | 60 | 0 |
| 1979 | 47 | 0 |
| 1980 | 78 | 0 |
| 1981 | 66 | 0 |
| 1982 | 73 | 0 |
| 1983 | 97 | 0 |
| 1984 | 88 | 0 |
| 1985 | 114 | 0 |
| 1986 | 137 | 0 |
| 1987 | 197 | 0 |
| 1988 | 189 | 0 |
| 1989 | 240 | 0 |
| 1990 | 200 | 0 |
| 1991 | 211 | 0 |
| 1992 | 202 | 0 |
| 1993 | 245 | 0 |
| 1994 | 286 | 0 |
| 1995 | 264 | 0 |
| 1996 | 313 | 0 |
| 1997 | 321 | 0 |
| 1998 | 373 | 0 |
| 1999 | 346 | 0 |
| 2000 | 404 | 0 |
| 2001 | 577 | 377 |
| 2002 | 611 | 949 |
| 2003 | 773 | 902 |
| 2004 | 803 | 984 |
| 2005 | 706 | 1018 |
| 2006 | 825 | 962 |
| 2007 | 794 | 900 |
| 2008 | 656 | 1250 |
| 2009 | 671 | 1306 |
| 2010 | 900 | 1289 |
| 2011 | 982 | 1229 |
| 2012 | 1207 | 1338 |
| 2013 | 1045 | 1104 |
| 2014 | 1152 | 1222 |
| 2015 | 1025 | 1093 |
| 2016 | 880 | 318 |
| 2017 | 672 | 267 |
| 2018 | 430 | 199 |
| 2019 | 306 | 154 |
| 2020 | 217 | 105 |
| 2021 | 130 | 79 |
| 2022 | 91 | 59 |
| 2023 | 66 | 45 |
| 2024 | 59 | 33 |
| 2025 | 34 | 17 |
| 2026 | 16 | 10 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Micro light-emitting diode display and method of manufacturing micro light-emitting diode display6 Oct 2026US 12,757,534 B2Chongqing Konka Photoelectric Technology Research Institute Co., Ltd.
- Automated assembly sensor cable22 Sep 2026US 12,744,134 B2Masimo Corporation
- Methods of forming interconnect circuits methods15 Sep 2026US 12,739,982 B2CelLink Corporation
- Offset interposers for large-bottom packages and large-die package-on-package structures8 Sep 2026US 12,733,556 B2Intel Corporation
- Thin dual-aperture zoom digital camera18 Aug 2026US 12,710,665 B2Corephotonics Ltd.
- Modular Flight Management System Incorporating An Autopilot1 Oct 2026US 2026/0300466 A1Skydio, Inc.
- Electronic device with multi-diameter female contacts and related methods1 Oct 2026US 2026/0304640 A1Eagle Technology, LLC
- Circuit board manufacturing system and method17 Sep 2026US 2026/0282242 A1Ufab Corporation
- Thin dual-aperture zoom digital camera21 May 2026US 2026/0140390 A1Corephotonics Ltd.
- Thin-film devices and fabrication23 Apr 2026US 2026/0109137 A1View Operating Corporation
Most cited
By later US patents
- Analyte monitoring device and methods of use2,634US 6,175,752 B1TheraSense, Inc. · 2001
- Analyte monitoring device and methods of use2,053US 6,565,509 B1TheraSense, Inc. · 2003
- Process for producing an electrochemical biosensor1,891US 6,103,033 ATheraSense, Inc. · 2000
- Method of manufacturing small volume in vitro analyte sensor1,347US 6,618,934 B1TheraSense, Inc. · 2003
- Tamper respondent system1,284US 7,787,256 B2Gore Enterprise Holdings, Inc. · 2010