Y10T 29/49147
Assembling terminal to base
Y10T29/49147 (Assembling terminal to base) appears on 3,215 US grants and 2,380 published applications in this corpus.
Search patents in Y10T- Granted patents
- 3,215
- Published applications
- 2,380
- Assignees
- 1,042
- Inventors
- 4,662
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 7 | 0 |
| 1977 | 11 | 0 |
| 1978 | 10 | 0 |
| 1979 | 10 | 0 |
| 1980 | 13 | 0 |
| 1981 | 8 | 0 |
| 1982 | 17 | 0 |
| 1983 | 20 | 0 |
| 1984 | 10 | 0 |
| 1985 | 19 | 0 |
| 1986 | 29 | 0 |
| 1987 | 21 | 0 |
| 1988 | 29 | 0 |
| 1989 | 31 | 0 |
| 1990 | 39 | 0 |
| 1991 | 41 | 0 |
| 1992 | 35 | 0 |
| 1993 | 41 | 0 |
| 1994 | 50 | 0 |
| 1995 | 40 | 0 |
| 1996 | 54 | 0 |
| 1997 | 56 | 0 |
| 1998 | 75 | 0 |
| 1999 | 80 | 0 |
| 2000 | 79 | 0 |
| 2001 | 115 | 89 |
| 2002 | 115 | 158 |
| 2003 | 153 | 190 |
| 2004 | 166 | 185 |
| 2005 | 132 | 195 |
| 2006 | 179 | 184 |
| 2007 | 181 | 158 |
| 2008 | 133 | 198 |
| 2009 | 120 | 176 |
| 2010 | 160 | 199 |
| 2011 | 149 | 124 |
| 2012 | 172 | 113 |
| 2013 | 119 | 85 |
| 2014 | 127 | 121 |
| 2015 | 110 | 107 |
| 2016 | 92 | 29 |
| 2017 | 66 | 16 |
| 2018 | 44 | 12 |
| 2019 | 13 | 10 |
| 2020 | 14 | 4 |
| 2021 | 7 | 9 |
| 2022 | 5 | 6 |
| 2023 | 9 | 7 |
| 2024 | 5 | 4 |
| 2025 | 2 | 1 |
| 2026 | 2 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Automated assembly sensor cable22 Sep 2026US 12,744,134 B2Masimo Corporation
- Textile blank with seamless knitted electrode system17 Mar 2026US 12,581,595 B2Honeywell Safety Products USA, Inc.
- Textile blank with seamless knitted electrode system23 Dec 2025US 12,507,343 B2Honeywell Safety Products USA, Inc.
- Package-on-package assembly with wire bond vias28 Jan 2025US 12,211,821 B2Adeia Semiconductor Technologies LLC
- Method for manufacturing a ceramic copper circuit board10 Dec 2024US 12,167,534 B2Kabushiki Kaisha Toshiba
- Package-on-package assembly with wire bond vias10 Apr 2025US 2025/0118705 A1Adeia Semiconductor Technologies LLC
- Textile blank with seamless knitted electrode system13 Jun 2024US 2024/0196529 A1Honeywell Safety Products USA, Inc.
- Textile blank with seamless knitted electrode system6 Jun 2024US 2024/0188214 A1Honeywell Safety Products USA, Inc.
- Stacked microfeature devices and associated methods9 May 2024US 2024/0153917 A1Micron Technology, Inc.
- Package-on-package assembly with wire bond vias15 Feb 2024US 2024/0055393 A1Invensas Corporation
Most cited
By later US patents
- Method of manufacturing small volume in vitro analyte sensor1,347US 6,618,934 B1TheraSense, Inc. · 2003
- Small volume in vitro analyte sensor with diffusible or non-leachable redox mediator1,214US 6,461,496 B1TheraSense, Inc. · 2002
- Strip electrode including screen printing of a single layer1,163US 5,509,410 AMedisense, Inc. · 1996
- Small volume in vitro analyte sensor with diffusible or non-leachable redox mediator1,026US 6,338,790 B12002
- Method of using a small volume in vitro analyte sensor with diffusible or non-leachable redox mediator991US 6,592,745 B1TheraSense, Inc. · 2003