Y10T 29/49149
By metal fusion bonding
Official title: by metal fusion bonding
Y10T29/49149 (By metal fusion bonding) appears on 1,227 US grants and 775 published applications in this corpus.
Search patents in Y10T- Granted patents
- 1,227
- Published applications
- 775
- Assignees
- 465
- Inventors
- 1,786
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 1 | 0 |
| 1978 | 3 | 0 |
| 1979 | 4 | 0 |
| 1980 | 4 | 0 |
| 1981 | 2 | 0 |
| 1982 | 5 | 0 |
| 1983 | 4 | 0 |
| 1984 | 2 | 0 |
| 1985 | 4 | 0 |
| 1986 | 8 | 0 |
| 1987 | 12 | 0 |
| 1988 | 15 | 0 |
| 1989 | 13 | 0 |
| 1990 | 14 | 0 |
| 1991 | 15 | 0 |
| 1992 | 14 | 0 |
| 1993 | 18 | 0 |
| 1994 | 23 | 0 |
| 1995 | 21 | 0 |
| 1996 | 30 | 0 |
| 1997 | 27 | 0 |
| 1998 | 36 | 0 |
| 1999 | 46 | 0 |
| 2000 | 52 | 0 |
| 2001 | 69 | 58 |
| 2002 | 64 | 76 |
| 2003 | 79 | 85 |
| 2004 | 86 | 73 |
| 2005 | 53 | 61 |
| 2006 | 71 | 49 |
| 2007 | 59 | 48 |
| 2008 | 40 | 66 |
| 2009 | 46 | 58 |
| 2010 | 55 | 37 |
| 2011 | 44 | 39 |
| 2012 | 42 | 22 |
| 2013 | 20 | 17 |
| 2014 | 32 | 33 |
| 2015 | 27 | 26 |
| 2016 | 23 | 6 |
| 2017 | 17 | 5 |
| 2018 | 6 | 4 |
| 2019 | 3 | 1 |
| 2020 | 4 | 1 |
| 2021 | 3 | 3 |
| 2022 | 2 | 1 |
| 2023 | 2 | 3 |
| 2024 | 1 | 2 |
| 2025 | 1 | 1 |
| 2026 | 1 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Automated assembly sensor cable22 Sep 2026US 12,744,134 B2Masimo Corporation
- Package-on-package assembly with wire bond vias28 Jan 2025US 12,211,821 B2Adeia Semiconductor Technologies LLC
- Stacked microfeature devices and associated methods30 Jan 2024US 11,887,970 B2Micron Technology, Inc.
- Package-on-package assembly with wire bond vias22 Aug 2023US 11,735,563 B2Invensas Corporation
- Automated assembly sensor cable17 Jan 2023US 11,557,407 B2Masimo Corporation
- Package-on-package assembly with wire bond vias10 Apr 2025US 2025/0118705 A1Adeia Semiconductor Technologies LLC
- Stacked microfeature devices and associated methods9 May 2024US 2024/0153917 A1Micron Technology, Inc.
- Package-on-package assembly with wire bond vias15 Feb 2024US 2024/0055393 A1Invensas Corporation
- Automated assembly sensor cable20 Jul 2023US 2023/0230726 A1Masimo Corporation
- Method for orienting solder balls on a bga device13 Apr 2023US 2023/0112097 A1Tahoe Research, Ltd.
Most cited
By later US patents
- Automated assembly sensor cable635US 9,697,928 B2Masimo Corporation · 2017
- Method of manufacturing electrical contacts, using a sacrificial member437US 5,476,211 AForm Factor, Inc. · 1995
- Three dimensional high performance interconnection package422US 5,371,654 AInternational Business Machines Corporation · 1994
- Method for forming contact pins for semiconductor dice and interconnects364US 5,495,667 AMicron Technology, Inc. · 1996
- Flexible contact structure with an electrically conductive shell340US 5,917,707 AFormFactor, Inc. · 1999