Y10T 29/49151
By deforming or shaping
Official title: by deforming or shaping
Y10T29/49151 (By deforming or shaping) appears on 875 US grants and 534 published applications in this corpus.
Search patents in Y10T- Granted patents
- 875
- Published applications
- 534
- Assignees
- 360
- Inventors
- 1,256
- Latest grant
- 28 Jan 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 5 | 0 |
| 1978 | 6 | 0 |
| 1979 | 2 | 0 |
| 1980 | 4 | 0 |
| 1981 | 4 | 0 |
| 1982 | 11 | 0 |
| 1983 | 15 | 0 |
| 1984 | 6 | 0 |
| 1985 | 14 | 0 |
| 1986 | 16 | 0 |
| 1987 | 4 | 0 |
| 1988 | 11 | 0 |
| 1989 | 15 | 0 |
| 1990 | 17 | 0 |
| 1991 | 19 | 0 |
| 1992 | 17 | 0 |
| 1993 | 18 | 0 |
| 1994 | 17 | 0 |
| 1995 | 14 | 0 |
| 1996 | 17 | 0 |
| 1997 | 23 | 0 |
| 1998 | 29 | 0 |
| 1999 | 21 | 0 |
| 2000 | 16 | 0 |
| 2001 | 29 | 20 |
| 2002 | 26 | 35 |
| 2003 | 30 | 46 |
| 2004 | 44 | 46 |
| 2005 | 35 | 67 |
| 2006 | 51 | 44 |
| 2007 | 51 | 41 |
| 2008 | 43 | 50 |
| 2009 | 30 | 54 |
| 2010 | 40 | 31 |
| 2011 | 42 | 25 |
| 2012 | 37 | 19 |
| 2013 | 25 | 18 |
| 2014 | 24 | 9 |
| 2015 | 18 | 14 |
| 2016 | 10 | 2 |
| 2017 | 7 | 2 |
| 2018 | 2 | 2 |
| 2019 | 1 | 2 |
| 2020 | 3 | 1 |
| 2021 | 1 | 1 |
| 2022 | 1 | 2 |
| 2023 | 2 | 1 |
| 2024 | 0 | 1 |
| 2025 | 1 | 1 |
By publication year. Applications have been published since 2001.
Subgroups
Granted patents
Recent patents
- Package-on-package assembly with wire bond vias28 Jan 2025US 12,211,821 B2Adeia Semiconductor Technologies LLC
- Package-on-package assembly with wire bond vias22 Aug 2023US 11,735,563 B2Invensas Corporation
- Semiautomatic machine for swaging connector pins13 Jun 2023US 11,678,473 B2Concord Electronics, Inc.
- Semiautomatic machine for swaging connector pins14 Jun 2022US 11,363,749 B2Concord Electronics, Inc.
- Package-on-package assembly with wire bond vias30 Nov 2021US 11,189,595 B2Invensas Corporation
- Package-on-package assembly with wire bond vias10 Apr 2025US 2025/0118705 A1Adeia Semiconductor Technologies LLC
- Package-on-package assembly with wire bond vias15 Feb 2024US 2024/0055393 A1Invensas Corporation
- Semiautomatic machine for swaging connector pins28 Dec 2023US 2023/0422457 A1Concord Electronics, Inc.
- Semiautomatic machine for swaging connector pins25 Aug 2022US 2022/0272882 A1Concord Electronics, Inc.
- Package-on-package assembly with wire bond vias26 May 2022US 2022/0165703 A1Invensas Corporation
Most cited
By later US patents
- Strip electrode including screen printing of a single layer1,163US 5,509,410 AMedisense, Inc. · 1996
- Strip electrode with screen printing524US 5,727,548 AMedisense, Inc. · 1998
- Method of manufacturing electrical contacts, using a sacrificial member437US 5,476,211 AForm Factor, Inc. · 1995
- Method of planarizing tips of probe elements of a probe card assembly397US 5,974,662 AFormFactor, Inc. · 1999
- Method of making high density integral test probe206US 6,332,270 B2International Business Machines Corporation · 2001