US 6,332,270 B2 · Method of making high density integral test probe

Abstract

A high density integrated test probe and method of fabrication is described. A group of wires are ball bonded to contact locations on the surface of a fan out substrate. The wires are sheared off leaving a stub, the end of which is flattened by an anvil. Before flattening a sheet of material having a group of holes is arranged for alignment with the group of stubs is disposed over the stubs. The sheet of material supports the enlarged tip. The substrate with stubs form a probe which is moved into engagement with contact locations on a work piece such as a drip or packaging substrate.

Claims12

Dependent claims

A method comprising the steps of:

providing a substrate having a surface;
bonding an elongated electrical conductor to said surface by forming a ball bond at said surface;
shearing said elongated conductor from said ball bond leaving an exposed end of said elongated conductor;
flattening said exposed end.

1 more element

Dependencies are inferred from the claim text.

Facts

Application

09/198,179Filed 23 Nov 1998

Published

US 2001/0040460 A115 Nov 2001

Granted

25 Dec 2001

Term ends

Not estimatedThe source records don’t support an estimate.

Classification10 codes

G01R 1/07378
With provisions for altering position, number or connection of probe tips; Adapting to differences in pitch: using an intermediate adapter, e.g.…
G01R 3/00
Apparatus or processes specially adapted for the manufacture or maintenance of measuring
G01R 1/07314
With individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or…:…
H10W 90/724
Of bump connectors: between a chip and a stacked insulating package substrate, interposer or RDL

Method of making high density integral test probe

Life of this patent

Method of making high density integral test probe

Life of this patent

Abstract

Claims12