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US 10,157,829 B2Granted
Method for forming a passive device on a package-on-package structure
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChih-Hua Chen, Chen-Shien Chen
Life of this patent
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Abstract
A device includes a polymer. A device die is disposed in the polymer. A passive device includes three Through Assembly Vias (TAVs) penetrating through the polymer, wherein the TAVs are coupled in series. A Redistribution Line (RDL) is underlying the polymer. The RDL electrically couples a first one of the TAVs to a second one of the TAVs.
Claims20
A method comprising:
- placing a device die over a carrier;
- forming a plurality of through-vias over the carrier;
- encapsulating the device die and the plurality of through-vias in an encapsulating material;
- thinning the encapsulating material, wherein after the thinning, ends of the through-vias are level with ends of conductive pillars of the device die, and wherein the ends of the through-vias and the ends of the conductive pillars are exposed through the encapsulating material;
- forming a first plurality of Redistribution Lines (RDLs) on a first side of the encapsulating material, wherein the first plurality of RDLs is electrically coupled to the plurality of through-vias;
- and
- interconnecting the plurality of through-vias using a plurality of conductive features to form a passive device, wherein the plurality of conductive features and the first plurality of RDLs are on opposite sides of the encapsulating material, and wherein the passive device comprises the plurality of through-vias and one of the first plurality of RDLs.
4 more elements
A method comprising:
- encapsulating a plurality of through-vias in an encapsulating material;
- performing a planarization to level ends of the plurality of through-vias with a surface of the encapsulating material;
- forming a first plurality of conductive lines on a first side of the encapsulating material;
- and
- forming a second plurality of conductive lines on a second side of the encapsulating material, wherein the plurality of through-vias, the first plurality of conductive lines, and the second plurality of conductive lines are electrically coupled in series to form a coil.
2 more elements
A method comprising:
- forming a plurality of through-vias over a carrier;
- encapsulating the plurality of through-vias in an encapsulating material;
- planarizing the encapsulating material, wherein after the planarizing, ends of the plurality of through-vias are substantially coplanar with a surface of the encapsulating material, and the ends of the plurality of through-vias are exposed through the encapsulating material;
- forming a first plurality of Redistribution Lines (RDLs) and a paramagnetic line simultaneously on a first side of the encapsulating material, wherein the first plurality of RDLs is electrically coupled to the plurality of through-vias;
- forming a second plurality of RDLs electrically coupled to the first plurality of RDLs;
- and
- forming a third plurality of RDLs on a second side of the encapsulating material opposite to the first side, wherein the first plurality of RDLs and the third plurality of RDLs are on opposite sides of the encapsulating material, and the first, the second, and the third plurality of RDLs and the plurality of through-vias are coupled serially to form a coil, with the paramagnetic line being encircled by the coil.
4 more elements
Dependencies are inferred from the claim text.