Back to results
US 9,814,135 B2Granted
Printed wiring board and method for manufacturing the same
AssigneeIbiden Co., Ltd.
InventorTakenobu Nakamura
Life of this patent
Estimating the term…
Abstract
A wiring board includes a substrate, pads formed on an electronic-component mounting surface of the substrate, and a resin insulation layer covering the electronic-component mounting surface and having opening portions such that the opening portions are exposing the pads, respectively. The pads include a non-solder mask defined pad having a wiring portion and a non-solder mask defined pad having no wiring portion, and the opening portions are formed such that the non-solder mask defined pads have exposed conductor areas which have substantially same areas inside the opening portions.
Claims10
A wiring board, comprising:
- a substrate;
- a plurality of pads formed on an electronic-component mounting surface of the substrate;
- and
- a resin insulation layer covering the electronic-component mounting surface and having a plurality of opening portions such that the plurality of opening portions is exposing the plurality of pads, respectively,
- wherein the plurality of pads includes a non-solder mask defined pad having a wiring portion and a non-solder mask defined pad having no wiring portion, and the plurality of opening portions is formed such that the non-solder mask defined pads have exposed conductor areas which have substantially same areas inside the opening portions.
2 more elements
Dependencies are inferred from the claim text.