US 9,998,032 B2Granted

Method of manufacturing a circuit device

AssigneeSemiconductor Components Industries, LLC

InventorsShigeaki Mashimo, Fumio Horiuchi, Kiyoaki Kudo, Akira Sakurai, Yuhki Inagaki

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Abstract

In one form, a method of manufacturing a circuit device comprises providing a lead frame comprising a plurality of leads, each comprising an island portion, a bonding portion elevated from the island portion, a slope portion extending obliquely so as to connect the island portion and the bonding portion, and a lead portion extending from the bonding portion. First and second transistors and first and second diodes are mounted upper surfaces of island portions of respective first and second leads, and are connected to the respective leads through wirings that connect the transistors and diodes to the bonding portions of the respective leads. Lower surfaces of the island portions are attached to an upper surface of a circuit board, and the circuit board, the transistors, the diodes, and the lead frame are encapsulated by a resin, so that the lead portions are not covered by the resin.

Claims11

Dependent claims

A method of manufacturing a circuit device, comprising:

providing a lead frame comprising a plurality of leads, each comprising an island portion, a bonding portion elevated from the island portion, a slope portion extending obliquely so as to connect the island portion and the bonding portion, and a lead portion extending from the bonding portion;
mounting a first transistor and a first diode of a first phase on an upper surface of the island portion of a first lead;
connecting the first transistor and the first diode of the first phase to a bonding portion of a second lead by a first wiring;
mounting a second transistor and a second diode of the first phase on the upper surface of the island portion of a third lead;
connecting the second transistor and the second diode of the first phase to a bonding portion of the second lead by a second wiring;
attaching lower surfaces of the island portion of each of the plurality of leads to an upper surface of a circuit board;
and
encapsulating by a resin the circuit board, the first and second transistors, the first and second diodes and the lead frame so that the lead portion of each of the plurality of leads are not covered by the resin.

5 more elements

Dependencies are inferred from the claim text.

Facts

Application: 15/702,228Filed 12 Sep 2017 · division
Priority: JP 2010-21369424 Sep 2010
Published: US 2018/0006578 A14 Jan 2018
Granted: 12 Jun 2018
Term ends: Not estimatedThe source records don’t support an estimate.

Classification29 codes

H02M 7/537
Using devices of a triode or transistor type requiring continuous application of a control signal: using semiconductor devices only, e.g. single…
H05K 1/0203
Thermal arrangements, e.g. for cooling, heating or preventing overheating: cooling of mounted components
H05K 1/181
Structurally associated with non-printed electric components: associated with surface mounted components
H10W 40/778
Auxiliary members characterised by their shape: in encapsulations

Family

Application13/242,202Parent of this division · filed 23 Sep 2011
Application15/003,958Parent of this division · filed 22 Jan 2016
US 2018/0006578 A1Pre-grant publication · published 4 Jan 2018
US 9,793,826 B2Parent of this division
US 9,275,930 B2Parent of this division
US 2012/0075816 A1Published application
US 2016/0211247 A1Published application
US 9,998,032 B2This patent

From the US filing history. Foreign family members aren’t listed.