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US 2019/0115298 A1Published application
Passive Devices in Package-on-Package Structures and Methods for Forming the Same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChih-Hua Chen, Chen-Shien Chen
Life of this patent
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Abstract
A device includes a polymer. A device die is disposed in the polymer. A passive device includes three Through Assembly Vias (TAVs) penetrating through the polymer, wherein the TAVs are coupled in series. A Redistribution Line (RDL) is underlying the polymer. The RDL electrically couples a first one of the TAVs to a second one of the TAVs.
Claims20
An integrated circuit package comprising:
- a molding compound comprising a top surface and a bottom surface;
- and
- a coil comprising:
- a plurality of vertical conductive features having lengthwise directions perpendicular to the top surface of the molding compound;
- a first plurality of horizontal conductive features having lengthwise directions parallel to the top surface of the molding compound;
- and
- a second plurality of horizontal conductive features having lengthwise directions parallel to the top surface of the molding compound, wherein the first plurality of horizontal conductive features and the second plurality of horizontal conductive features are on opposite sides of the molding compound, and wherein an axis of the coil is parallel to the top surface of the molding compound.
4 more elements
An integrated circuit package comprising:
- a device die;
- an encapsulant embedding the device die therein;
- a first dielectric layer comprising a bottom surface contacting a top surface of the encapsulant;
- a second dielectric layer comprising a top surface contacting a bottom surface of the encapsulant;
- and
- a coil comprising portions extending into the encapsulant, the first dielectric layer, and the second dielectric layer, wherein the coil comprises a plurality of horizontal conductive lines and a plurality of vertical conductive lines, and the encapsulant is free from horizontal portions of the coil therein.
3 more elements
An integrated circuit package comprising:
- a first package component comprising:
- an encapsulant;
- a device die in the encapsulant;
- and
- a first through-via and a second plurality of through-vias penetrating through the encapsulant;
- and
- a device comprising:
- a first plurality of redistribution lines overlying the encapsulant;
- and
- a second plurality of redistribution lines underlying the encapsulant, wherein the second plurality of through-vias, the first plurality of redistribution lines, and the second plurality of redistribution lines are serially connected;
- a second package component over and bonded to the first package component;
- and
- a solder region underlying and attached to the first package component, wherein the second package component is electrically coupled to the solder region through the first through-via.
10 more elements
Dependencies are inferred from the claim text.