Y10T 29/49158
With molding of insulated base
Official title: with molding of insulated base
Y10T29/49158 (With molding of insulated base) appears on 696 US grants and 528 published applications in this corpus.
Search patents in Y10T- Granted patents
- 696
- Published applications
- 528
- Assignees
- 343
- Inventors
- 1,220
- Latest grant
- 21 Apr 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 2 | 0 |
| 1978 | 1 | 0 |
| 1979 | 2 | 0 |
| 1980 | 2 | 0 |
| 1981 | 2 | 0 |
| 1982 | 6 | 0 |
| 1983 | 5 | 0 |
| 1984 | 1 | 0 |
| 1985 | 6 | 0 |
| 1986 | 7 | 0 |
| 1987 | 8 | 0 |
| 1988 | 4 | 0 |
| 1989 | 9 | 0 |
| 1990 | 12 | 0 |
| 1991 | 10 | 0 |
| 1992 | 5 | 0 |
| 1993 | 16 | 0 |
| 1994 | 15 | 0 |
| 1995 | 14 | 0 |
| 1996 | 11 | 0 |
| 1997 | 12 | 0 |
| 1998 | 15 | 0 |
| 1999 | 10 | 0 |
| 2000 | 16 | 0 |
| 2001 | 22 | 13 |
| 2002 | 22 | 36 |
| 2003 | 33 | 33 |
| 2004 | 25 | 40 |
| 2005 | 22 | 36 |
| 2006 | 30 | 33 |
| 2007 | 38 | 37 |
| 2008 | 35 | 64 |
| 2009 | 23 | 40 |
| 2010 | 29 | 37 |
| 2011 | 37 | 26 |
| 2012 | 38 | 35 |
| 2013 | 35 | 22 |
| 2014 | 30 | 21 |
| 2015 | 18 | 25 |
| 2016 | 16 | 9 |
| 2017 | 20 | 5 |
| 2018 | 7 | 3 |
| 2019 | 7 | 1 |
| 2020 | 3 | 1 |
| 2021 | 2 | 4 |
| 2022 | 0 | 1 |
| 2023 | 2 | 4 |
| 2024 | 4 | 2 |
| 2025 | 1 | 0 |
| 2026 | 2 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Panel-molded electronic assemblies21 Apr 2026US 12,610,471 B2Vicor Corporation
- Panel-molded electronic assemblies31 Mar 2026US 12,593,411 B1Vicor Corporation
- Fixed plug for use in a process of forming an insulated register box15 Apr 2025US 12,276,434 B2
- Manufacturing method for pcb with thermal conductor embedded therein, and pcb17 Dec 2024US 12,171,057 B2Shengyi Electronics Co., Ltd.
- Method for manufacturing ceramic substrate and ceramic substrate26 Nov 2024US 12,155,367 B2Murata Manufacturing Co., Ltd.
- Method of manufacturing electronic device11 Jul 2024US 2024/0237224 A9Samsung Display Co., Ltd.
- Method of manufacturing electronic device25 Apr 2024US 2024/0138072 A1Samsung Display Co., Ltd.
- Method for retrofitting a register box with an expandable polymeric foam material7 Dec 2023US 2023/0392819 A1Sterling Custom Sheet Metal, Inc.
- Process for forming a register box that is adaptable to ductwork of an hvac system22 Jun 2023US 2023/0194121 A1Sterling Custom Sheet Metal, Inc.
- Locating collar for insulated register box25 May 2023US 2023/0160601 A1Sterling Custom Sheet Metal, Inc.
Most cited
By later US patents
- Microelectronic mounting with multiple lead deformation and bonding475US 5,518,964 ATessera, Inc. · 1996
- Three dimensional high performance interconnection package422US 5,371,654 AInternational Business Machines Corporation · 1994
- Test probe for high density integrated circuits, methods of fabrication thereof and methods of use thereof284US 5,821,763 AInternational Business Machines Corporation · 1998
- Method of forming a three dimensional high performance interconnection package271US 5,531,022 AInternational Business Machines Corporation · 1996
- Test probe having elongated conductor embedded in an elostomeric material which is mounted on a space transformer256US 5,635,846 AInternational Business Machines Corporation · 1997