Manufacturing method for pcb with thermal conductor embedded therein, and pcb

A method for manufacturing a printed circuit board (PCB) with an embedded thermal conductor, comprising:

• stacking a core with an opening or a specified daughter board with an opening with at least one bonding sheet with an opening in a predetermined sequence to form a stack, the openings of the core or specified daughter board and the at least one bonding sheet forming a thermal conductor accommodation hole;
• arranging a thermal conductor including a conductive layer in the thermal conductor accommodation hole of the stack such that the thermal conductor is flush with the stack;
• stacking a first sheet of copper foil and a second sheet of copper foil on either side of the stack with the thermal conductor in the accommodation hole to form a stacked structure, wherein each of the first sheet of copper foil and the second sheet of copper foil has no opening;
• performing a lamination process on the stacked structure at a high temperature to form a laminate, wherein a part of a surface of the laminate covering the thermal conductor protrudes from an other part of the surface of the laminate not covering the thermal conductor;
• removing a part of the first sheet of copper foil covering the thermal conductor and a part of the second sheet of copper foil covering the thermal conductor from the laminate, to expose the conductive layer of the thermal conductor;
• and
• manufacturing an outer layer pattern on an outer layer of the thermal conductor and/or an outer layer of the laminate not covering the thermal conductor of the laminate.