H10W 72/963
Providing mechanical bonding or support
Official title: {Providing mechanical bonding or support, e.g. dummy bond pads}
H10W72/963 (Providing mechanical bonding or support) appears on 372 US grants and 489 published applications in this corpus.
Search patents in H10W- Granted patents
- 372
- Published applications
- 489
- Assignees
- 73
- Inventors
- 591
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2002 | 1 | 0 |
| 2003 | 1 | 1 |
| 2004 | 0 | 2 |
| 2005 | 1 | 5 |
| 2006 | 2 | 0 |
| 2007 | 0 | 1 |
| 2008 | 3 | 1 |
| 2009 | 1 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 1 |
| 2012 | 0 | 3 |
| 2013 | 0 | 4 |
| 2014 | 7 | 7 |
| 2015 | 4 | 9 |
| 2016 | 15 | 20 |
| 2017 | 9 | 8 |
| 2018 | 16 | 14 |
| 2019 | 13 | 30 |
| 2020 | 32 | 57 |
| 2021 | 39 | 69 |
| 2022 | 51 | 81 |
| 2023 | 60 | 46 |
| 2024 | 54 | 56 |
| 2025 | 49 | 44 |
| 2026 | 14 | 30 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Image sensor and method of manufacturing image sensor15 Sep 2026US 12,740,175 B2Samsung Electronics Co., Ltd.
- Display device1 Sep 2026US 12,724,310 B2Samsung Display Co., Ltd.
- Integrated circuit packages and methods4 Aug 2026US 12,702,051 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor package23 Jun 2026US 12,666,969 B2Samsung Electronics Co., Ltd.
- Semiconductor package and method of fabricating the same9 Jun 2026US 12,653,071 B2Samsung Electronics Co., Ltd.
- Semiconductor package1 Oct 2026US 2026/0305356 A1Samsung Electronics Co., Ltd.
- Method for manufacturing semiconductor device, and semiconductor device1 Oct 2026US 2026/0305500 A1Resonac Corporation
- Semiconductor device including dummy pad17 Sep 2026US 2026/0282393 A1Samsung Electronics Co., Ltd.
- Semiconductor device and method of manufacturing the same17 Sep 2026US 2026/0282998 A1Samsung Electronics Co., Ltd.
- Semiconductor device structure with bonding pad and method for forming the same27 Aug 2026US 2026/0256023 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Barrier structure against corrosion and contamination in three-dimensional (3-D) wafer-to-wafer vertical stack497US 6,661,085 B2Intel Corporation · 2003
- Bonding structure for stacked semiconductor devices254US 9,230,941 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Hybrid bonding with uniform pattern density252US 9,299,736 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Semiconductor device252US 9,799,587 B2Sony Corporation · 2017
- Semiconductor device structure with a conductive feature passing through a passivation layer240US 10,276,619 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2019