Semiconductor package and method of fabricating the same
AssigneeSamsung Electronics Co., Ltd.
InventorsHyoungjoo Lee, Sang-Sick Park, Chungsun Lee, Seungyoon Jung
Life of this patent
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Abstract
A method includes providing a first structure, forming a connection pad on the first structure, forming a preliminary connection member on the connection pad, forming an adhesion layer on the first structure, the adhesion layer covering the preliminary connection member, removing a portion of the adhesion layer to expose an exposure surface of the preliminary connection member, providing a second structure, forming a chip pad and a dummy pad on the second structure, and covering the chip pad and the dummy pad with the adhesion layer that has been formed on the first structure. A thickness of the dummy pad is greater than a thickness of the chip pad.
Claims11
A method comprising:
- providing a first structure;
- forming a connection pad on the first structure;
- forming a preliminary connection member on the connection pad;
- forming an adhesion layer on the first structure, the adhesion layer covering the preliminary connection member;
- removing a portion of the adhesion layer to expose an exposure surface of the preliminary connection member;
- providing a second structure;
- forming a chip pad and a dummy pad on the second structure;
- and
- covering the chip pad and the dummy pad with the adhesion layer that has been formed on the first structure,
- wherein a thickness of the dummy pad is greater than a thickness of the chip pad.
A method comprising:
- providing a first structure on which is disposed a connection pad and a preliminary connection member is disposed on the connection pad;
- forming an adhesion layer on the first structure, the adhesion layer covering the preliminary connection member;
- removing a portion of the adhesion layer to expose an exposure surface of the preliminary connection member;
- providing a second structure;
- forming a chip pad and a dummy pad on the second structure;
- thermally compressing the adhesion layer and the dummy pad against each other;
- and
- thermally compressing the exposure surface of the preliminary connection member and the chip pad against each other,
- wherein the exposure surface and the chip pad are separated from each other while the adhesion layer and the dummy pad are thermally compressed against each other, and
- wherein a thickness of the dummy pad is greater than a thickness of the chip pad.
Dependencies are inferred from the claim text.