H10W 72/653
Not comprising solid metals or solid metalloids
Official title: {not comprising solid metals or solid metalloids, e.g. polymers, ceramics or liquids}
H10W72/653 (Not comprising solid metals or solid metalloids) appears on 34 US grants and 44 published applications in this corpus.
Search patents in H10W- Granted patents
- 34
- Published applications
- 44
- Assignees
- 22
- Inventors
- 98
- Latest grant
- 14 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 1 |
| 2007 | 0 | 0 |
| 2008 | 0 | 1 |
| 2009 | 1 | 1 |
| 2010 | 1 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 2 |
| 2014 | 2 | 2 |
| 2015 | 1 | 2 |
| 2016 | 2 | 2 |
| 2017 | 1 | 0 |
| 2018 | 0 | 3 |
| 2019 | 2 | 4 |
| 2020 | 4 | 3 |
| 2021 | 4 | 8 |
| 2022 | 5 | 8 |
| 2023 | 0 | 1 |
| 2024 | 6 | 3 |
| 2025 | 3 | 2 |
| 2026 | 1 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor package with a cured electrically conductive paste interconnect and method for producing the same14 Jul 2026US 12,685,209 B2Nexperia B. V.
- Semiconductor module17 Jun 2025US 12,334,409 B2Fuji Electric Co., Ltd.
- Package with pad having open notch17 Jun 2025US 12,334,458 B2Infineon Technologies AG
- Semiconductor device and methods of manufacturing semiconductor devices25 Mar 2025US 12,261,145 B2Amkor Technology Singapore Holding Pte.Ltd.
- Electronic apparatus and method for manufacturing electronic apparatus24 Dec 2024US 12,176,322 B2Fuji Electric Co., Ltd.
- Method of manufacturing semiconductor devices and corresponding semiconductor device3 Sep 2026US 2026/0262526 A1STMicroelectronics International N. V.
- 3d printed bridges for printed interconnects4 Dec 2025US 2025/0372904 A1
- Semiconductor device and methods of manufacturing semiconductor devices12 Jun 2025US 2025/0192093 A1Amkor Technology Singapore Holding Pte.Ltd.
- Method for Fabricating a Semiconductor Device5 Dec 2024US 2024/0404983 A1Infineon Technologies AG
- Power module and fabrication method of the same, graphite plate, and power supply equipment3 Oct 2024US 2024/0332122 A1Rohm Co., Ltd.
Most cited
By later US patents
- Current sensor139US 7,598,601 B2Allegro MicroSystems, LLC · 2009
- Durable substrate subassembly for transistor switch module32US 5,895,974 ADelco Electronics Corporation · 1999
- Semiconductor device having multiple contact clips5US 9,837,380 B2Infineon Technologies Austria AG · 2017
- Electronic device and method of manufacturing the same3US 10,373,889 B2Denso Corporation · 2019
- Package structure for power device2US 11,183,439 B2Actron Technology Corporation · 2021