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US 12,334,409 B2Granted
Semiconductor module
AssigneeFuji Electric Co., Ltd.
InventorYasufumi Hara
Life of this patent
Estimating the term…
Abstract
Provided is a semiconductor module, including: a semiconductor chip including a semiconductor substrate and a metal electrode provided above the semiconductor substrate; a protective film provided above the metal electrode; a plated layer provided above the metal electrode, having at least a part being in a height identical to the protective film; a solder layer provided above the plated layer; and a lead frame provided above the solder layer, wherein the plated layer is provided in a range not in contact with the protective film.
Claims21
A semiconductor module, comprising:
- a semiconductor chip including a semiconductor substrate and a metal electrode provided above the semiconductor substrate;
- a protective film provided above the metal electrode;
- a plated layer provided above the metal electrode, having at least a part being in a height identical to the protective film;
- a solder layer provided above the plated layer;
- and
- a lead frame provided above the solder layer,
- wherein the plated layer is provided in a range that is not in contact with the protective film and does not overlap with the protective film in a top view.
4 more elements
A semiconductor module, comprising:
- a semiconductor chip including a semiconductor substrate and a metal electrode provided above the semiconductor substrate;
- a protective film provided above the metal electrode;
- a plated layer provided on an upper surface of the metal electrode;
- a solder layer provided above the plated layer;
- and
- a lead frame provided above the solder layer,
- wherein the plated layer is provided in a range not in contact with the protective film, and
- the plated layer does not overlap with the protective film in a top view.
5 more elements
Dependencies are inferred from the claim text.