Package structure for power device

A package structure for power devices, comprising:

• a heat dissipation insulating substrate, comprising a first surface and a second surface which are opposite to each other,
• a plurality of power devices, coupled to the first surface of the heat dissipation insulating substrate;
• a heat dissipation baseplate, disposed at the second surface of the heat dissipation insulating substrate, wherein a surface of at least one of the heat dissipation baseplate and the heat dissipation insulating substrate contacting with the thermal interface layer has a plurality of plateaus, the plateaus are disposed within a projected area of all of the power devices, and an area ratio of the plateaus occupying the surface of the heat dissipation baseplate or the second surface of the heat dissipation insulating substrate is between 10% and 35%;
• and
• a thermal interface layer, respectively contacting with and disposed between the second surface of the heat dissipation insulating substrate and the heat dissipation baseplate, wherein a minimum thickness of the thermal interface layer within the projected area of the plurality of power devices is less than a thickness thereof outside the projected area of the plurality of power devices.