Power module and fabrication method of the same, graphite plate, and power supply equipment

A power module comprising:

• a substrate comprising a first main electrode pattern, a second main electrode pattern, and a signal wiring pattern on a front side surface of the substrate;
• a semiconductor device comprising a main pad electrode and a control pad electrode, on a front side surface thereof and a back side electrode, on a back side surface thereof, the semiconductor device disposed on the substrate;
• a connection frame connected between the main pad electrode and the first main electrode pattern;
• a second bonded portion separated from a first bonded portion between the connection frame and the main pad electrode, the second bonded portion between the connection frame and the first main electrode pattern;
• and
• a first bonding wire connected between the second bonded portion and the signal wiring pattern, wherein
• the second bonded portion has a temperature relatively lower than the first bonded portion at a time of operation of the semiconductor device.