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US 12,334,458 B2Granted
Package with pad having open notch
AssigneeInfineon Technologies AG
InventorAdrian Lis
Life of this patent
Estimating the term…
Abstract
A package is disclosed. In one example, the package comprises an electronic component having a first main surface with an electrically conductive first pad. The first pad has an open notch, and a spacer body mounted on the first pad and bridging at least part of the open notch.
Claims14
A package which comprises:
- an electronic component having a first main surface with an electrically conductive first pad, the first pad having an open notch;
- and
- a spacer body mounted on the first pad and bridging at least part of the open notch,
- wherein the electronic component has an electrically conductive second pad on the first main surface;
- wherein the second pad is arranged so as to be substantially equidistantly spaced from the first pad along the open notch of the first pad and outside of the open notch of the first pad;
- wherein the second pad is shaped in accordance with at least one of the group consisting of a circular shape, a hexagon shape, and an octagon shape;
- wherein the first main surface has an electrically insulating region at the open notch of the first pad;
- and
- wherein the spacer body bridges the open notch of the first pad without direct physical contact with the electrically insulating region.
6 more elements
A method of manufacturing a package, wherein the method comprises:
- providing an electronic component having a first main surface with an electrically conductive first pad, the first pad having an open notch,
- mounting a spacer body on the first pad so that the spacer body bridges at least part of the open notch,
- wherein the electronic component has an electrically conductive second pad on the first main surface,
- wherein the second pad is arranged so as to be substantially equidistantly spaced from the first pad along the open notch of the first pad and outside of the open notch of the first pad,
- wherein the second pad is shaped in accordance with at least one of the group consisting of a circular shape, a hexagon shape, and an octagon shape,
- wherein the first main surface has an electrically insulating region at the open notch of the first pad, and
- wherein the spacer body bridges the open notch of the first pad without direct physical contact with the electrically insulating region.
4 more elements
A package, comprising:
- an electronic component with an electrically conductive first pad having an open notch and with an electrically conductive second pad;
- wherein the second pad is arranged so as to be substantially equidistantly spaced from the first pad along the open notch and fully outside of the open notch of the first pad;
- and
- wherein the second pad is shaped in accordance with at least one of the group consisting of a circular shape, a hexagon shape, and an octagon shape.
1 more element
Dependencies are inferred from the claim text.